China RF/mmWave Module Substrate Manufacturing - 25μm Line Width, 0.18mm Thickness, 1-6 Layer Custom IC Packaging for sale
China RF/mmWave Module Substrate Manufacturing - 25μm Line Width, 0.18mm Thickness, 1-6 Layer Custom IC Packaging for sale

RF/mmWave Module Substrate Manufacturing - 25μm Line Width, 0.18mm Thickness, 1-6 Layer Custom IC Packaging

Professional RF/mmWave module substrate manufacturing with 25μm minimum line width and 0.18mm finished thickness. Customizable 1-6 layer designs using premium materials including SHENGYI, Mitsubishi, and Rogers. Advanced capabilities for IC packaging, memory electronics, and wireless modules with technical support for large customers.

Place of Origin china
Packaging Details carton customized
Color Black
Material BT
Line Space 30um
Supply Ability 30000 square meters per month
Product Description
RF/mmWave Module Substrate Manufacturing
Applications

IC packaging, microelectronics devices, microelectronics assembly, semiconductor packaging, memory electronics, NAND/Flash memory, and advanced module applications.

Substrate Specifications
Parameter Specification
Minimum Line Space/Width 1 mil (25μm)
Finished Thickness 0.18mm
Material Brands SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others
Surface Finish Immersion gold (primary), OSP, immersion silver, tin, and custom options
Copper Weight 0.5oz or customized
Layer Count 1-6 layers (customizable)
Soldermask Green or customized (TAIYO INK, ABQ brands)
Manufacturing Capabilities
  • Advanced technology: L/S 20/20μm, 10/10μm
  • BT+ABF materials compatibility
  • Wire bonding substrate (BGA)
  • Embedded memory IC substrate
  • MEMS/CMOS and module applications (RF, Wireless, Bluetooth)
  • 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
  • Buildup technology with buried/blind vias
  • Flipchip CSP and advanced IC packaging
HOREXS Manufacturing Excellence

HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer with 60,000 square meters of production space and over $300 million USD investment. Annual capacity of 600,000 SQM with Tenting & SAP processes. Committed to becoming a top-three IC substrate manufacturer in China and world-class PCB manufacturer.

Inquiry Requirements
  • Substrate production specifications
  • Gerber files and drilling files
  • Quantity requirements including samples
  • Layer stack-up/build-up information for multilayer substrates
Get Better Price & Quality

Contact HOREXS for competitive pricing and high-quality IC substrates. Technical support available for large customers. Shipping via DHL, UPS, FedEx, and air freight options.

Interested in this product?
Contact us now for more details and a custom quote.