China 0.2mm Thickness Semiconductor Assembly Substrate - 0.18mm Finished, 25μm Line Width, 1-6 Layer Customizable for sale
China 0.2mm Thickness Semiconductor Assembly Substrate - 0.18mm Finished, 25μm Line Width, 1-6 Layer Customizable for sale
China 0.2mm Thickness Semiconductor Assembly Substrate - 0.18mm Finished, 25μm Line Width, 1-6 Layer Customizable for sale

0.2mm Thickness Semiconductor Assembly Substrate - 0.18mm Finished, 25μm Line Width, 1-6 Layer Customizable

Advanced 0.2mm thickness semiconductor assembly substrate for microelectronics packaging with 0.18mm finished thickness and 25μm minimum line width. Customizable 1-6 layers with multiple material options including SHENGYI and Mitsubishi BT-FR4. Supports IC packaging, memory electronics, and various semiconductor applications with comprehensive technical support.

Place of Origin china
Packaging Details carton customized
Color Black
Material BT
Line Space 40um
Supply Ability 30000 square meters per month
Product Description
Product Overview

0.2mm thickness semiconductor assembly substrate designed for advanced microelectronics packaging applications including IC packaging, semiconductor packaging, and memory electronics.

Technical Specifications
Parameter Specification
Minimum Line Space/Width 1 mil (25μm)
Finished Thickness 0.18mm
Copper Weight 0.5oz (Customizable)
Layer Count 1-6 layers (Customizable)
Material Brands SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others
Surface Finish Immersion gold (Customizable: OSP, Immersion silver, tin, more)
Soldermask Green (Customizable) - Brands: TAIYO INK, ABQ
Applications
  • IC Package Substrates
  • Semiconductor Packaging
  • Memory Electronics
  • NAND/Flash Memory
  • Wire Bonding Substrates (BGA)
  • Embedded Memory IC Substrates
  • MEMS/CMOS Modules
  • RF, Wireless, Bluetooth Modules
  • Flipchip CSP
Manufacturing Capabilities
HOREXS Manufacturing Excellence

HOREXS-Hubei, part of HOREXS Group, operates a 60,000 square meter facility with over $300 million USD investment. Annual IC substrate production capacity reaches 600,000 square meters utilizing Tenting & SAP processes.

Advanced technology capabilities include L/S 20/20μm and 10/10μm processing with BT+ABF materials support.

Inquiry Requirements

For accurate quotation and production planning, please provide:

  • Complete substrate production specifications
  • Gerber files and drilling files
  • Quantity requirements (including samples)
  • For multilayer substrates: layer stack-up/build-up information
Get Better Pricing & Quality

Contact HOREXS for competitive pricing on high-quality IC substrates with comprehensive technical support for large-volume customers.

Shipping Options
  • DHL/UPS/FedEx Express
  • Air Freight
  • Custom Express Services (DHL/UPS/FedEx)
Interested in this product?
Contact us now for more details and a custom quote.