LED Chip IC Package Substrate Manufacturing - 1-6 Layers, 25μm Line Width, 600,000 SQM Annual Capacity
Professional IC substrate manufacturing for LED chip packaging with 1-6 layer customization, 25μm minimum line width, and 600,000 SQM annual production capacity. Features advanced technologies including wire bonding, MEMS/CMOS modules, and buildup flipchip CSP. HOREXS provides cost-effective solutions with superior quality and technical support for semiconductors, miniLED, and MicroLED applications.
Place of Origin
china
Packaging Details
carton customized
Color
Black
Material
BT
Line Space
40um
Supply Ability
30000 square meters per month
Product Description
IC Substrate Manufacturing for LED Chip Packaging
Applications
- Semi Package & LED Chip Package
- Semiconductors & IC Package
- miniLED & MicroLED
- MEMS & IC Assembly
- Storage IC Substrate
Substrate Production Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | FR4/BT (0.1-0.4mm) |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others |
| Surface Finish | Mainly immersion gold, customizable options including OSP/immersion silver, tin, and more |
| Copper | 0.5oz or Customizable |
| Layers | 1-6 layers (Customizable) |
| Soldermask | Green or Customizable (Brands: TAIYO INK, ABQ) |
Manufacturing Capabilities
HOREXS-Hubei Facility
- 60,000 square meters floor space
- $300 million USD investment
- Annual IC Substrate Capacity: 600,000 SQM
- Tenting & SAP Process Technology
- Advanced Technology: L/S 20/20μm, 10/10μm
- BT+ABF Materials Support
Technical Support
- Wire Bonding Substrate (BGA)
- Embedded Memory IC Substrate
- MEMS/CMOS Modules (RF, Wireless, Bluetooth)
- 2/4/6 Layer Configurations (1+2+1/2+2+2/1+4+1)
- Buildup (Buried/Blind Hole) Flipchip CSP
- Other Ultra IC Package Substrate Solutions
Inquiry Requirements
- Substrate production specification information
- Gerber files and drilling files
- Quantity requirements including samples
- For multilayer substrates: layer stack-up/buildup information
Shipping & Logistics
DHL/UPS/FedEX | Air Freight | Custom Express Services
Contact HOREXS Today
Get better pricing and superior quality IC substrates with our technical support and cost-saving solutions.
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Interested in this product?
Contact us now for more details and a custom quote.