Lights & Lighting Lighting Accessories Other Lighting Accessories
China MicroLED/MiniLED Package Substrate - 1mil Line Width, 0.1-0.4mm Thickness, 1-6 Layer PCB for sale
China MicroLED/MiniLED Package Substrate - 1mil Line Width, 0.1-0.4mm Thickness, 1-6 Layer PCB for sale
China MicroLED/MiniLED Package Substrate - 1mil Line Width, 0.1-0.4mm Thickness, 1-6 Layer PCB for sale

MicroLED/MiniLED Package Substrate - 1mil Line Width, 0.1-0.4mm Thickness, 1-6 Layer PCB

Advanced fine pitch Micro PCB boards with 1mil line spacing for LED displays and lighting applications. Featuring 600,000 SQM/year manufacturing capacity, BT/FR4 materials, and customizable specifications including immersion gold finish and 0.5oz copper. Professional IC substrate manufacturer with technical support for high-volume requirements.

Place of Origin china
Packaging Details carton customized
Color Black
Material BT
Line Space 65um
Supply Ability 8000 square meters per month
high speed micro centrifuge stand up paddle board inflatable home chalk board
Product Description
Fine Pitch Micro PCB Board with superior registration accuracy for advanced LED display applications.
Applications
LED displays, LED lighting PCBs, outdoor LED systems
PCB Specifications
Parameter Specification
Line Space/Width 1 mil (25μm)
Finished Thickness BT/FR4 (0.1-0.4mm)
Material Brands SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others
Surface Finish Immersion gold (primary), OSP, Immersion silver, tin, custom options
Copper Weight 0.5oz or customizable
Layers 1-6 layers (customizable)
Soldermask Green or customizable (Brands: TAIYO INK, ABQ)
Manufacturing Capabilities
  • 600,000 SQM/year IC substrate capacity
  • Tenting & SAP process technologies
  • Advanced L/S 20/20μm, 10/10μm capabilities
  • BT+ABF material processing
  • 60,000 square meter facility with $300M investment
Supported Technologies
Wire bonding substrates (BGA), Embedded memory IC substrates, MEMS/CMOS, RF/Wireless/Bluetooth modules, 2/4/6 layer builds, Buildup (buried/blind hole), Flipchip CSP, and other ultra IC package substrates
Inquiry Requirements
  • Substrate production specifications
  • Gerber files and drilling files
  • Quantity requirements including samples
  • Layer stack-up information for multilayer substrates
Shipping & Logistics
DHL, UPS, FedEx, air freight, and custom express services
Contact Horexs
Get better pricing and superior quality substrates with technical support for high-volume customers.

Recommended Products

China BT FR4 NAND Memory Substrate Board 35/35μm 4-Layer ENEPIG for DRAM/SSD/LPDDR Packaging for sale
BT FR4 NAND Memory Substrate Board 35/35μm 4-Layer ENEPIG for DRAM/SSD/LPDDR Packaging
Price: US 120-150 per square meter
China Microelectronics Package Substrate Manufacturing - 1-6 Layers, 0.18mm Thickness, 25μm Line Width for IC & Semiconductor Packaging for sale
Microelectronics Package Substrate Manufacturing - 1-6 Layers, 0.18mm Thickness, 25μm Line Width for IC & Semiconductor Packaging
Price: US 120-150 per square meter
China BGA Memory Substrate with ENEPIG ENIG Surface Finish - 1 mil Line Width, 0.1-0.4mm BT Thickness for sale
BGA Memory Substrate with ENEPIG ENIG Surface Finish - 1 mil Line Width, 0.1-0.4mm BT Thickness
Price: US 120-150 per square meter
China BT Material Semiconductor Package Substrate L/S 35/35μm - 0.1-0.4mm Thickness with 20μm Line/Space Capability for sale
BT Material Semiconductor Package Substrate L/S 35/35μm - 0.1-0.4mm Thickness with 20μm Line/Space Capability
Price: US 120-150 per square meter
China Horexs 0.2mm Thickness BGA Package Substrate with 25μm Line Width and 0.1-0.4mm FR4 Material for sale
Horexs 0.2mm Thickness BGA Package Substrate with 25μm Line Width and 0.1-0.4mm FR4 Material
Price: US 120-150 per square meter
China 2-6 Layer BT Material BGA Packaging Substrate 0.18mm Thickness 25μm Line Width for Semiconductor Assembly for sale
2-6 Layer BT Material BGA Packaging Substrate 0.18mm Thickness 25μm Line Width for Semiconductor Assembly
Price: US 120-150 per square meter
China BT FR4 4-Layer CSP Substrate with ENEPIG Finish - 25μm Line Width, 0.1-0.4mm Thickness for IC Packaging for sale
BT FR4 4-Layer CSP Substrate with ENEPIG Finish - 25μm Line Width, 0.1-0.4mm Thickness for IC Packaging
Price: US 120-150 per square meter
China ENIG Wire Bond BGA Package Substrate 0.18mm Thickness 1-6 Layers IC Packaging for sale
ENIG Wire Bond BGA Package Substrate 0.18mm Thickness 1-6 Layers IC Packaging
Price: US 120-150 per square meter
Interested in this product?
Contact us now for more details and a custom quote.