China 0.2mm 2-Layer Memory Card Substrate for IC Encapsulation - 25μm Line Width, 0.29mm Thickness for sale
China 0.2mm 2-Layer Memory Card Substrate for IC Encapsulation - 25μm Line Width, 0.29mm Thickness for sale
China 0.2mm 2-Layer Memory Card Substrate for IC Encapsulation - 25μm Line Width, 0.29mm Thickness for sale
China 0.2mm 2-Layer Memory Card Substrate for IC Encapsulation - 25μm Line Width, 0.29mm Thickness for sale

0.2mm 2-Layer Memory Card Substrate for IC Encapsulation - 25μm Line Width, 0.29mm Thickness

Precision 0.2mm 2-layer memory card substrate with 25μm minimum line width and 0.29mm finished thickness. Supports Micro SD, TF cards, USB devices, and IC assembly with customizable 4-layer options. Manufactured by HOREXS with advanced capabilities including wire bonding, flipchip CSP, and buildup technologies. Ideal for semiconductor packaging and wearable electronics applications.

Place of Origin china
Packaging Details carton customized
Color Customize
Material SYTech BT
Line Space 50um
Supply Ability 30000 square meters per month
Product Description
Product Overview

0.2mm 2-layer memory card substrate designed for high-performance encapsulation applications in semiconductor packaging. This precision substrate supports various memory card formats and IC assembly requirements.

Applications
  • Memory cards (Micro SD, Micro TF, UDP)
  • USB devices and chip substrates
  • IC assembly substrates and semiconductor packaging
  • Wearable electronics and NAND/Flash memory packages
  • RF, wireless, and Bluetooth modules
Technical Specifications
Parameter Specification
Minimum Line Space/Width 1 mil (25μm)
Finished Thickness 0.29mm
Copper Weight 0.5oz (Customizable)
Layer Count 4 layers (Customizable)
Surface Finish Immersion gold (OSP/Immersion silver/tin available)
Soldermask Green (Customizable, TAIYO INK brand)
Material Options

Premium material brands including SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others.

Manufacturing Capabilities

HOREXS Group - Leading IC substrate manufacturer with 60,000㎡ facility and $300M investment. Annual capacity: 600,000 SQM with Tenting & SAP processes.

  • Advanced technology: L/S 20/20μm, 10/10μm
  • BT+ABF materials support
  • Wire bonding substrates and embedded memory IC substrates
  • Flipchip CSP and buildup (buried/blind hole) technologies
Inquiry Requirements
  • Complete substrate production specifications
  • Gerber files and drilling files
  • Quantity requirements including samples
  • Layer stack-up information for multilayer substrates
Get Started

Contact HOREXS for competitive pricing, superior quality substrates, and comprehensive technical support. Our mission is to help you save costs while maintaining high-quality standards.

Shipping Options: DHL, UPS, FedEx, air freight, and customized express services.

Interested in this product?
Contact us now for more details and a custom quote.