Ultra Thin FR4 Multi-Layer PCB for Memory Card Encapsulation - 0.29mm Thickness, 1mil Line Width
Professional FR4 multi-layer PCB substrate for memory card encapsulation and IC packaging. Features 0.29mm finished thickness, 1mil line width precision, and customizable 4-layer construction. Manufactured by HOREXS with 600,000 SQM annual capacity, supporting advanced semiconductor applications including MicroSD cards and wearable electronics.
Memory cards, MicroSD cards, MicroTF cards, semiconductor packaging, IC assembly, IC substrates, wearable electronics, NAND/Flash memory packages
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.29mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (standard), OSP, immersion silver, tin (customizable) |
| Copper Weight | 0.5oz or customizable |
| Layer Count | 4 layers (customizable) |
| Soldermask | Green (standard), customizable colors (TAIYO INK brand) |
HOREXS-Hubei Manufacturing Facility:
- 60,000 square meters facility in Huangshi City, Hubei Province
- $300 million USD investment
- Annual IC Substrate Capacity: 600,000 SQM
- Tenting & SAP process technologies
- Advanced capabilities: L/S 20/20μm, 10/10μm
- BT+ABF material processing
For accurate quotations and production planning, please provide:
- Complete substrate production specifications
- Gerber files and drilling files
- Quantity requirements (including samples)
- Layer stack-up information for multilayer substrates
HOREXS provides comprehensive technical support for high-volume customers, including design optimization and cost-saving solutions while maintaining premium quality standards.
DHL, UPS, FedEx, air freight, and customized express services available.
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