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China Custom Black Memory IC Substrate for Memory Cards - 0.18mm Thickness, 12μm Copper, 2 Layer Design for sale

Custom Black Memory IC Substrate for Memory Cards - 0.18mm Thickness, 12μm Copper, 2 Layer Design

Name: Custom Black Memory IC Substrate for Memory Cards - 0.18mm Thickness, 12μm Copper, 2 Layer Design
Brand: HongRuiXing (Hubei) Electronics Co.,Ltd.

Professional black memory IC substrate for NAND, flash memory, and SD card applications. Features 0.18mm thickness, 12μm copper layers, and advanced 10/10μm line spacing. Manufactured by HOREXS with 600,000 SQM annual capacity, supporting wire bonding, embedded memory, and RF modules. No MOQ requirements with global shipping options.

Place of Origin china

Packaging Details carton customized

Color Black

Material FR4

Supply Ability 30000 square meters per month

Certification UL

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Product Description

Product Overview

Custom black memory IC substrate designed specifically for memory card applications. This semiconductor packaging substrate serves as a critical carrier material that connects integrated circuit chips to PCBs while providing circuit protection, specialized routing, heat dissipation, and standardized IC component modules.

Applications

NAND memory systems
Flash memory devices
Smart electronics
Mobile phones and digital electronics
SD cards and memory cards

Technical Specifications

Parameter	Specification
Minimum Line Space/Width	35/35μm - 20/20μm - 10/10μm
Finished Thickness	0.18mm
Raw Materials	SHENGYI, Mitsubishi, Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others
Surface Finish	ENIG/ENEPIG/OSP/Soft Gold/Hard Gold
Copper Thickness	12μm
Layers	2 layers
Soldermask/PSR	Green Taiyo brand/AUS 308/AUS 320/AUS 410/SR-1700, 300 series

Manufacturer Profile

HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer located in Huangshi City, Hubei Province, China. The facility spans over 60,000 square meters with an investment exceeding $300 million USD. Annual production capacity reaches 600,000 square meters using Tenting & SAP processes. The company specializes in advanced technologies including L/S 20/20μm and 10/10μm, BT+ABF materials, and supports various packaging types including wire bonding substrates, embedded memory IC substrates, MEMS/CMOS, and RF/wireless/bluetooth modules.

Production Capabilities

Total Capacity: 65,000 SQM/month across two factories
Technology: 2/4/6 layer buildup with buried/blind vias
Packaging Support: Flipchip CSP and other ultra IC package substrates

Frequently Asked Questions

Where are HOREXS factories located?

HOREXS Group operates two facilities: one in Huizhou City, Guangdong Province and another in Hubei Province.

Is there a minimum order quantity?

No minimum order quantity (MOQ) or minimum order value (MOV) requirements.

Can HOREXS handle large volume production?

Yes, with combined monthly capacity of 65,000 square meters across both factories.

Who should I contact for cooperation?

Contact: AKEN
Email: [email protected]
Provides support for roadmap/design rules files and production capability documentation.

Does HOREXS provide IC package design services?

No, we focus exclusively on semiconductor IC substrate manufacturing, though we can connect clients with design partners.

What information is needed for quotation?

Gerber files
Production specifications
Buildup/stackup information for multilayer substrates
Additional supporting documentation

Can HOREXS produce FCBGA package substrates?

FCBGA substrate manufacturing is planned to begin in 2024 or 2025.

Special Note for Large Customers: Please share detailed requirements for customized technical support. HOREXS is committed to helping clients reduce costs while maintaining high quality standards.

Shipping Options