Consumer Electronic Computer Hardware & Software RAMs

China BGA Memory Substrate Manufacturing - 10/10μm Line Width, 0.21mm Thickness for DDR and Flash Devices for sale

BGA Memory Substrate Manufacturing - 10/10μm Line Width, 0.21mm Thickness for DDR and Flash Devices

Name: BGA Memory Substrate Manufacturing - 10/10μm Line Width, 0.21mm Thickness for DDR and Flash Devices
Brand: HongRuiXing (Hubei) Electronics Co.,Ltd.

Professional BGA packaging memory substrate manufacturing with 10/10μm minimum line width, 0.21mm thickness, and 600,000 sqm annual capacity. Supports DDR, MicroSD, flash memory applications with ENIG/ENEPIG surface finishes and advanced BT+ABF materials for superior IC packaging performance.

Place of Origin china

Packaging Details carton customized

Color Black

Package type BGA package

Material BT

Supply Ability 8000 square meters per month

type n female connector type t thermocouple extension wire kingston micro sd memory card

Product Description

BGA Memory Substrate Overview

BGA (Ball Grid Array) packaging represents a critical semiconductor packaging technology for memory electronics manufacturing. These substrates provide essential high-quality connections between memory integrated circuits and PCBs while protecting internal circuitry, managing heat dissipation, and serving as standardized IC component modules.

Applications

DDR Memory Modules
MicroSD Devices
Flash Memory Devices
Computer Electronics
SD Cards / Memory Cards

Technical Specifications

Parameter	Specification
Minimum Line Space/Width	35/35μm - 20/20μm - 10/10μm
Finished Thickness	0.21mm
Copper Thickness	12μm
Layer Count	2 Layers
Raw Materials	SHENGYI, Mitsubishi, Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others
Surface Finish	ENIG/ENEPIG/OSP/Soft Gold/Hard Gold
Soldermask/PSR	Green Taiyo Brand/AUS 308/AUS 320/AUS 410/SR-1700, 300 Series

Manufacturing Capabilities

HOREXS-Hubei, part of HOREXS Group, operates from a 60,000 square meter facility in Huangshi City, Hubei Province, China. With over $300 million USD investment, the facility delivers annual IC substrate capacity of 600,000 square meters using Tenting & SAP processes.

Advanced Technology

Supports line/space down to 10/10μm, BT+ABF materials, and various packaging technologies including Wire Bonding, Embedded Memory IC Substrate, MEMS/CMOS, RF/Wireless/Bluetooth Modules, and Flipchip CSP.

Frequently Asked Questions

Company Locations

HOREXS operates two manufacturing facilities: original factory in Huizhou City, Guangdong and new facility in Hubei Province.

Order Requirements

No minimum order quantity (MOQ) or minimum order value (MOV) restrictions currently apply.

Production Capacity

Original factory: 15,000 sqm/month | New factory: 50,000 sqm/month

Quotation Requirements

Submit Gerber files, production specifications, buildup/stackup information for multilayer substrates, and any additional relevant documentation.

FCBGA Capability

FCBGA substrate manufacturing scheduled for implementation in 2024-2025.

Contact Information