Camera Module IC Substrate Manufacturing - 1mil Line Width, 0.18mm Thickness, 600K SQM Annual Capacity
Professional IC substrate manufacturing for camera modules with 1mil line width precision, 0.18mm thickness, and 600,000 SQM annual capacity. Supports wire bonding, embedded memory, RF modules, and flipchip CSP packaging with customizable materials and surface finishes. Advanced Tenting & SAP process technology for superior performance in consumer electronics and semiconductor applications.
High-precision camera module substrate manufacturing with advanced IC substrate technology for consumer electronics, sensors, and semiconductor packaging applications.
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.18mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (standard), customizable options including OSP, immersion silver, tin |
| Copper Weight | 0.5oz (customizable) |
| Layer Count | 1-6 layers (customizable) |
| Soldermask | Green (standard), customizable colors using TAIYO INK or ABQ brands |
- 600,000 SQM annual IC substrate production capacity
- Advanced Tenting & SAP process technology
- Line/Space capability: 20/20μm, 10/10μm
- BT+ABF material compatibility
- 60,000 square meter manufacturing facility
- $300 million USD facility investment
- Wire bonding substrate (BGA)
- Embedded memory IC substrate
- MEMS/CMOS modules
- RF, Wireless, Bluetooth modules
- 2/4/6 layer buildup substrates with buried/blind vias
- Flipchip CSP packaging
For accurate quotation and production planning, please provide:
- Substrate production specifications
- Gerber files and drilling files
- Quantity requirements including samples
- Layer stack-up/build-up information for multilayer substrates
Global shipping support via DHL, UPS, FedEx, and air freight services with customizable express options.
Contact HOREXS for competitive pricing, superior quality IC substrates, and comprehensive technical support to optimize your production costs while maintaining high-quality standards.
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