Multilayer BT Materials Semiconductor Package Substrate 0.18mm Thickness 1-6 Layer Customizable IC Packaging
Professional multilayer BT materials semiconductor package substrate with 0.18mm thickness and 1 mil line spacing. Customizable 1-6 layers, immersion gold finish, and 0.5oz copper. Supports DRAM, memory cards, IC packaging with 600,000 SQM annual capacity. Advanced wire bonding, embedded memory, and buildup technologies available.
Place of Origin
china
Packaging Details
carton customized
Material
BT
Model Number
NC-02
type
IC substrate
Supply Ability
50000sqm/ month
Product Description
Multilayer BT Materials Semiconductor Package Substrate
Applications
- DRAM memory electronics
- SD card, memory card, MicroSD, MicroTF card
- Flash memory card, DDR
- Semiconductor packaging, IC substrate
- MCP, UFS, CMOS, MEMS
- IC assembly, storage IC substrate
- NAND/Flash memory applications
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.18mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (standard), OSP, immersion silver, tin (customizable) |
| Copper Weight | 0.5oz or customizable |
| Layer Count | 1-6 layers (customizable) |
| Soldermask | Green standard (TAIYO INK, ABQ brands), customizable colors |
Manufacturing Capabilities
HOREXS-Hubei is part of HOREXS Group, a leading IC substrate manufacturer located in Huangshi City, Hubei Province, China.
- 60,000 square meters facility
- $300 million USD investment
- Annual IC substrate capacity: 600,000 SQM
- Tenting & SAP process technologies
- Advanced line/space capability: 20/20μm, 10/10μm
- BT+ABF materials processing
Advanced Technology Support
- Wire bonding substrate (BGA)
- Embedded memory IC substrate
- MEMS/CMOS modules
- RF, wireless, Bluetooth modules
- 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
- Buildup technology with buried/blind vias
- Flipchip CSP packaging
- Ultra IC package substrate solutions
Inquiry Requirements
For accurate quotation and technical support, please provide:
- Substrate production specifications
- Gerber files and drilling files
- Quantity requirements (including samples)
- For multilayer substrates: layer stack-up/build-up information
Shipping & Logistics
DHL, UPS, FedEx, air freight, and customized express services available.
Contact HOREXS today for competitive pricing and superior quality IC substrates!
Recommended Products
Price: US 95-120 per square meter
Price: US 120-150 per square meter
Price: US 120-150 per square meter
Price: US 120-150 per square meter
Price: US 85-120 each square meter
Price: US 98-120 square meter
Price: US 0.1-0.12 each piece
Interested in this product?
Contact us now for more details and a custom quote.