Flash/NAND Memory Package Substrate 0.18mm Thickness 25μm Line Width Custom IC Packaging Solutions
Professional IC substrate manufacturing for flash memory and semiconductor packaging. Features 0.18mm thickness, 25μm minimum line width, 1-6 customizable layers, and immersion gold surface finish. HOREXS offers 600,000 SQM annual capacity with advanced SAP processing and technical support for high-volume applications.
Place of Origin
china
Packaging Details
carton customized
Material
BT
Model Number
NC-02
type
IC substrate
Supply Ability
50000sqm/ month
Product Description
Flash/NAND Memory Package Substrate Solutions
Product Applications
- SD Cards & Memory Cards (MicroSD, MicroTF)
- Flash Memory Cards & DDR Modules
- Semiconductor Packaging (IC Substrate, MCP, UFS)
- CMOS, MEMS, and IC Assembly Applications
- Storage IC Substrates & NAND/Flash Memory
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.18mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion Gold (Custom: OSP, Immersion Silver, Tin) |
| Copper Weight | 0.5oz or Custom |
| Layer Count | 1-6 Layers (Customizable) |
| Soldermask | Green or Custom (TAIYO INK, ABQ Brands) |
Manufacturing Capabilities
HOREXS-Hubei Manufacturing Facility:
- 60,000 square meter production facility
- $300+ million USD investment
- Annual IC Substrate Capacity: 600,000 SQM
- Tenting & SAP Process Technologies
- Advanced Line/Space: 20/20μm, 10/10μm
- BT+ABF Material Processing
Advanced Technology Support
- Wire Bonding Substrate (BGA)
- Embedded Memory IC Substrate
- MEMS/CMOS & Module Applications (RF, Wireless, Bluetooth)
- 2/4/6 Layer Configurations (1+2+1/2+2+2/1+4+1)
- Buildup (Buried/Blind Hole) Flipchip CSP
- Ultra IC Package Substrate Solutions
Inquiry Requirements
- Complete substrate production specifications
- Gerber files with drilling data
- Quantity requirements (including samples)
- Multilayer stack-up/build-up information
Shipping & Logistics
DHL, UPS, FedEx Express Services | Air Freight | Custom Express Solutions
Contact for Custom Solutions
HOREXS provides technical support and cost-effective solutions for high-volume customers. Our mission: deliver superior quality while helping you save costs.
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Interested in this product?
Contact us now for more details and a custom quote.