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China Wire Bonding Memory Substrate with Gold Plating - 25μm Line Width, 0.18mm Thickness, 1-6 Layer Custom IC Package for sale
China Wire Bonding Memory Substrate with Gold Plating - 25μm Line Width, 0.18mm Thickness, 1-6 Layer Custom IC Package for sale
China Wire Bonding Memory Substrate with Gold Plating - 25μm Line Width, 0.18mm Thickness, 1-6 Layer Custom IC Package for sale

Wire Bonding Memory Substrate with Gold Plating - 25μm Line Width, 0.18mm Thickness, 1-6 Layer Custom IC Package

Professional wire bonding memory substrate with gold plating for IC and semiconductor packaging. Features 25μm minimum line width, 0.18mm thickness, and 1-6 layer customization. Supports NAND/Flash memory applications with 600,000 SQM annual capacity and advanced manufacturing technology including BT+ABF materials.

Place of Origin china
Packaging Details carton customized
Material BT
Model Number FC-00
type IC substrate
Supply Ability 30000M2/ month
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Product Description
Wire Bonding Memory Substrate with Gold Plating
Applications

IC package, Semiconductor package, Memory electronics, NAND/Flash memory applications

Technical Specifications
Parameter Specification
Minimum Line Space/Width 1mil (25μm)
Finished Thickness 0.18mm
Copper Weight 0.5oz or Customized
Layer Count 1-6 Layers (Customized)
Surface Finish Mainly immersion gold, supports OSP/immersion silver, tin, and custom options
Soldermask Green or Customized (Brands: TAIYO INK, ABQ)
Material Brands

SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others

Manufacturing Capabilities
  • IC Substrate Capacity: 600,000 SQM/Year
  • Advanced Technology: L/S 20/20μm, 10/10μm
  • Material Support: BT+ABF materials
  • Process Capabilities: Tenting & SAP process
Product Support
  • Wire Bonding Substrate (BGA)
  • Embedded Memory IC Substrate
  • MEMS/CMOS, Module (RF, Wireless, Bluetooth)
  • 2/4/6 Layer Configurations (1+2+1/2+2+2/1+4+1)
  • Buildup (Buried/Blind Hole) Flipchip CSP
  • Other Ultra IC Package Substrate Solutions
Inquiry Requirements
  • Substrate production specification information
  • Gerber files and drilling files
  • Quantity requirements including samples
  • For multilayer substrates: layer stack-up/buildup information
Shipping & Support

DHL/UPS/FedEx, Air freight, and customized express services available. Technical support provided for large volume customers.

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