BGA IC Package Substrate with 0.29mm Thickness and 25μm Line Width - MGC BT Material for Semiconductor Packaging
High-performance IC substrate featuring 0.29mm thickness and 25μm minimum line width, manufactured using MGC BT materials. Supports memory cards, wearable electronics, and NAND/Flash memory packages with customizable specifications. Produced by HOREXS with 600,000 SQM annual capacity and advanced Tenting & SAP processes for superior semiconductor packaging solutions.
High-performance IC substrate designed for advanced semiconductor packaging applications including memory cards, wearable electronics, and NAND/Flash memory packages.
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.29mm |
| Copper Weight | 0.5oz or Customized |
| Layer Count | 4 layers (Customizable) |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (Customizable: OSP, Immersion silver, tin) |
| Soldermask | Green or Customized (TAIYO INK brand) |
- Memory cards (MicroSD, MicroTF)
- Semiconductor IC packaging and assembly
- Wearable electronics
- NAND/Flash memory packages
- MEMS/CMOS modules
- RF, Wireless, Bluetooth modules
HOREXS-Hubei Facility: 60,000 sqm manufacturing space with $300 million USD investment
Annual Capacity: 600,000 SQM of IC substrates
Advanced Technology: L/S 20/20μm, 10/10μm with BT+ABF materials
Process Support: Tenting & SAP processes
- Substrate production specifications
- Gerber files and drilling files
- Quantity requirements (including samples)
- Layer stack-up information for multilayer substrates
Contact HOREXS for competitive pricing, superior quality substrates, and technical support. Our mission is to help you save costs while maintaining high quality standards.
Shipping Options: DHL, UPS, FedEx, Air freight
Recommended Products
