HOREXS Semiconductor IC Package Substrate with 25μm Line Width and 0.29mm Thickness for Wire Bonding Applications
Professional IC substrate solutions featuring 1mil (25μm) minimum line width, 0.29mm finished thickness, and 600,000 SQM annual capacity. Supports wire bonding, embedded memory, and flipchip CSP packaging with customizable materials and surface finishes. Advanced manufacturing capabilities include BT+ABF materials and fine line technology for memory cards, wearable electronics, and semiconductor applications.
Professional IC substrate solutions for advanced semiconductor packaging applications including memory cards, UDP, and bonding PCB printed circuit boards.
- Memory cards (MicroSD, MicroTF, UDP)
- Semiconductor IC packaging and assembly
- Wearable electronics
- NAND/Flash memory packaging
- MEMS/CMOS modules
- RF, Wireless, Bluetooth modules
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1mil (25μm) |
| Finished Thickness | 0.29mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (customizable: OSP, immersion silver, tin) |
| Copper | 0.5oz or customizable |
| Layers | 4 layers (customizable) |
| Soldermask | Green or customizable (TAIYO INK brand) |
- Factory area: 60,000 square meters
- Investment: $300 million USD
- Annual capacity: 600,000 square meters
- Advanced processes: Tenting & SAP
- Fine line technology: L/S 20/20μm, 10/10μm
- Material support: BT+ABF materials
- Wire bonding substrate (BGA)
- Embedded memory IC substrate
- 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
- Buildup technology with buried/blind vias
- Flipchip CSP packaging
For accurate quotation and technical support, please provide:
- Substrate production specifications
- Gerber files and drilling files
- Quantity requirements (including samples)
- Layer stack-up information for multilayer substrates
We support worldwide shipping via DHL, UPS, FedEx, and air freight services.
HOREXS Mission: Help you save costs while maintaining high quality standards with comprehensive technical support for large-scale customers.
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