Camera Module IC Substrate PCB 0.2mm Thickness with 10/10μm Line Width for Electronics Manufacturing
Ultra-thin 0.2mm FR4 IC substrate PCB designed for camera electronics and imaging systems. Features 10/10μm minimum line width, 12μm copper thickness, and multiple surface finish options. Manufactured by HOREXS with 600,000 SQM annual capacity and no MOQ requirements. Ideal for CCD cameras, camera modules, and advanced imaging applications.
Ultra-thin FR4 PCB boards specifically engineered for camera electronics applications including CCD cameras and camera modules. These substrates feature exceptional precision and reliability for demanding imaging systems.
- Camera electronics and imaging systems
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 35/35μm - 20/20μm - 10/10μm |
| Finished Thickness | 0.2mm |
| Raw Material | SHENGYI, Mitsubishi, Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others |
| Surface Finish | ENIG/ENEPIG/OSP/Soft Gold/Hard Gold |
| Copper Thickness | 12μm |
| Layers | 2 Layer |
| Soldermask/PSR | Green Taiyo brand/AUS 308/AUS 320/AUS 410/SR-1700,300 series |
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer with 60,000 square meters of production space and over $300 million USD investment. Annual capacity of 600,000 SQM with Tenting & SAP processes.
Advanced technology includes L/S 20/20μm, 10/10μm, BT+ABF materials. Supports wire bonding substrates, embedded memory IC substrates, MEMS/CMOS, RF/wireless/Bluetooth modules, and various buildup configurations.
- No minimum order quantity (MOQ) requirements
- High-volume production capacity: 15,000 SQM/month (Guangdong) + 50,000 SQM/month (Hubei)
- FCBGA package substrate production planned for 2024-2025
Contact: AKEN | Email: [email protected]
Required for quotation: Gerber files, production specifications, buildup/stackup information for multilayer substrates.
- DHL / UPS / FedEx
- Air freight / Sea freight
- Custom express services available
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