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China UDP/USB Memory Substrate Manufacturing - 1-6 Layers, 25μm Line Width, 0.2mm Thickness for sale
China UDP/USB Memory Substrate Manufacturing - 1-6 Layers, 25μm Line Width, 0.2mm Thickness for sale
China UDP/USB Memory Substrate Manufacturing - 1-6 Layers, 25μm Line Width, 0.2mm Thickness for sale

UDP/USB Memory Substrate Manufacturing - 1-6 Layers, 25μm Line Width, 0.2mm Thickness

Professional IC substrate manufacturing for UDP/USB memory products with 1-6 layer customization, 25μm minimum line width, and 0.2mm finished thickness. Advanced materials including SHENGYI and Mitsubishi, with surface finish options and 600,000 SQM annual capacity. Complete technical support and global shipping available.

Place of Origin china
Packaging Details carton customized
Material BT/FR4
Model Number GC-08
type IC substrate
Supply Ability 1000M2/ month
Product Description
UDP/USB Memory Substrate Manufacturing
Applications
  • IC Package Substrates
  • Semiconductor Packaging
  • UDP/USB Products
  • Memory Electronics
  • NAND/Flash Memory
Substrate Specifications
Parameter Specification
Minimum Line Space/Width 1 mil (25μm)
Finished Thickness 0.2mm
Copper Weight 0.5oz or Custom
Layer Count 1-6 Layers (Custom)
Surface Finish Immersion Gold (Custom: OSP/Immersion Silver/Tin)
Soldermask Green or Custom (TAIYO INK, ABQ brands)
Material Brands
SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others
Manufacturing Capability
HOREXS-Hubei, part of HOREXS Group, operates a 60,000 square meter facility with annual IC substrate capacity of 600,000 SQM. Advanced technologies include L/S 20/20μm, 10/10μm with BT+ABF materials.
Inquiry Requirements
  • Substrate production specifications
  • Gerber files and drilling files
  • Quantity requirements including samples
  • Layer stack-up information for multilayer substrates
Shipping & Support
DHL, UPS, FedEx, Air Freight, and Custom Express services available. Technical support provided for large volume customers.

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