NAND Memory Package Substrate Manufacturing - 1mil Line Width, 0.24mm Thickness, 1-6 Layer Custom IC Boards
Professional NAND memory package substrate manufacturing with 1mil line width precision and 0.24mm thickness. Custom 1-6 layer designs using premium materials from SHENGYI, Mitsubishi, and Rogers. Annual capacity of 600,000 SQM with advanced 10/10μm technology for FBGA/PBGA semiconductor packaging applications.
Advanced IC substrate solutions for NAND memory packages, flash memory, and semiconductor applications with precision manufacturing capabilities.
- NAND memory package substrates
- Memory and storage electronics
- Flash memory applications
- FBGA/PBGA semiconductor packaging
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.24mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (standard), OSP, immersion silver, tin, custom options |
| Copper Weight | 0.5oz or customizable |
| Layer Count | 1-6 layers (customizable) |
| Soldermask | Green standard, customizable (TAIYO INK, ABQ brands) |
HOREXS-Hubei Facility: 60,000 square meters production area with $300 million USD investment
Annual Capacity: 600,000 SQM IC substrates
Advanced Technology: L/S 20/20μm, 10/10μm capabilities
Material Expertise: BT+ABF materials processing
Supported Applications: Wire bonding substrates, embedded memory IC substrates, MEMS/CMOS, RF/wireless/Bluetooth modules
- Substrate production specifications
- Gerber files and drilling files
- Quantity requirements including samples
- Layer stack-up/build-up information for multilayer substrates
Global shipping support via DHL, UPS, FedEx, and air freight with customized express options.
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