0.15mm IC Assembly Package Substrate for Semiconductor Packaging - 1mil Line Width, 0.29mm Thickness
High-performance IC assembly package substrate with 0.15mm thickness and 1mil line width precision. Supports memory cards, DRAM electronics, and semiconductor packaging applications. Features customizable 4-layer construction, immersion gold finish, and compatibility with leading material brands. HOREXS manufacturing provides 600,000 SQM annual capacity with advanced Tenting & SAP processes.
Place of Origin
china
Packaging Details
carton customized
Material
BT
type
IC substrate
Supply Ability
30000 square meters per month
Certification
UL
Product Description
IC Assembly Package Substrate - 0.15mm Thickness
Applications
IC cards, bank cards, SIM cards
DRAM memory electronics and SD cards
MicroSD, MicroTF cards, and flash memory cards
DDR, MCP, UFS, CMOS, MEMS components
IC packaging, IC substrates, and storage IC substrates
Wearable electronics and NAND/Flash memory packages
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.29mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others |
| Surface Finish | Immersion gold (standard), OSP, immersion silver, tin (customizable) |
| Copper Weight | 0.5oz or customizable |
| Layers | 4 layers (customizable) |
| Soldermask | Green (standard), customizable (TAIYO INK brand) |
Manufacturing Capabilities
HOREXS-Hubei, part of HOREXS Group, operates a 60,000 square meter facility with over $300 million USD investment. Annual production capacity reaches 600,000 square meters using Tenting & SAP processes.
Advanced Technology
Line/Space: 20/20μm, 10/10μm capabilities
BT+ABF materials compatibility
Wire bonding substrates (BGA)
Embedded memory IC substrates
MEMS/CMOS modules (RF, wireless, Bluetooth)
2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
Buildup technology with buried/blind vias
Flipchip CSP and other ultra IC package substrates
Inquiry Requirements
Substrate production specifications
Gerber files and drilling files
Quantity requirements including samples
Layer stack-up information for multilayer substrates
Shipping & Support
DHL, UPS, FedEx, air freight, and customized express services available.
Contact HOREXS
For superior pricing and quality in IC substrates, contact HOREXS for technical support and cost-saving solutions.
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