Precision 0.15mm IC Packaging Substrate with 25μm Line Width and 0.29mm Thickness for Semiconductor Applications
Advanced 0.15mm IC packaging substrate featuring ultra-fine 25μm line width, 0.29mm thickness, and 600,000 SQM annual manufacturing capacity. Supports wire bonding, embedded memory, MEMS/CMOS modules with customizable materials and surface finishes. HOREXS Group provides technical support for semiconductor packaging applications.
Place of Origin
china
Packaging Details
carton customized
Material
BT
Model Number
NC-02
type
IC substrate
Supply Ability
30000sqm/ month
Product Description
Product Overview
Precision 0.15mm IC packaging substrate designed for advanced semiconductor applications with ultra-fine line capabilities down to 25μm.
Applications
- Bank cards, IC cards, SIM cards
- DRAM memory electronics
- SD cards, memory cards, MicroSD, MicroTF cards
- Flash memory cards, DDR modules
- Semiconductor packaging (MCP, UFS, CMOS, MEMS)
- IC assembly and substrate manufacturing
- Wearable electronics
- NAND/Flash memory packaging
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.29mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (standard), OSP, Immersion silver, tin (customizable) |
| Copper Weight | 0.5oz (customizable) |
| Layer Count | 4 layers (customizable) |
| Soldermask | Green (standard), customizable colors (TAIYO INK brand) |
Manufacturing Capabilities
HOREXS Group - Hubei Facility
- 60,000 square meter manufacturing facility in Huangshi City, Hubei Province
- $300 million USD investment
- Annual IC substrate capacity: 600,000 square meters
- Tenting & SAP process technologies
- Advanced capabilities: L/S 20/20μm, 10/10μm
- BT+ABF material processing
Technical Support Services
- Wire bonding substrate (BGA)
- Embedded memory IC substrate
- MEMS/CMOS modules
- RF, Wireless, Bluetooth modules
- 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
- Buildup technology with buried/blind vias
- Flipchip CSP packaging
Inquiry Requirements
Required Information for Quotation:
- Substrate production specifications
- Gerber files and drilling files
- Quantity requirements (including samples)
- Layer stack-up information for multilayer substrates
Shipping & Logistics
DHL, UPS, FedEx, Air freight, and customized express services
Recommended Products
Price: US 120-150 per square meter
Price: US 120-150 per square meter
Price: US 120-150 per square meter
Price: US 0.11-0.13 each piece
Price: US 120-150 per square meter
Price: US 120-150 per square meter
25μm Line/Space FBGA Package Substrate for Memory IC - 0.22mm Thickness, 4-Layer Customizable Design
Price: US 120-150 per square meter
Price: US 0.1-0.12 each piece
Interested in this product?
Contact us now for more details and a custom quote.