BT Semiconductor IC Packaging Substrate 0.35mm Thickness 25μm Line Width 1-6 Layer Custom Manufacturing
Professional BT semiconductor IC packaging substrate manufacturing with 0.35mm thickness and 25μm minimum line width. Customizable 1-6 layer designs using premium materials from SHENGYI, Mitsubishi, and Rogers. Advanced capabilities include 600,000 SQM annual capacity, wire bonding substrates, and buildup technology for memory electronics and semiconductor packages.
Place of Origin
china
Packaging Details
carton customized
Material
BT
Model Number
NC-01
type
IC substrate
Supply Ability
30000M2/ month
Product Description
BT Semiconductor IC Packaging Substrate Manufacturing
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer in China with advanced production capabilities including 600,000 SQM annual capacity and 20/20μm line space/width technology.
Applications
DRAM memory electronics, SD cards, memory cards, MicroSD, MicroTF cards, Flash memory cards, DDR, semiconductor packages, IC substrates, MCP, UFS, CMOS, MEMS, IC assembly, storage IC substrates, NAND/Flash memory, and various IC packaging solutions.
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1mil (25μm) |
| Finished Thickness | 0.35mm |
| Copper Weight | 0.5oz or Customized |
| Layers | 1-6 layers (Customized) |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (standard), OSP, immersion silver, tin (customized) |
| Soldermask | Green or Customized (TAIYO INK, ABQ brands) |
Manufacturing Capabilities
- 60,000 square meter facility in Huangshi City, Hubei Province
- $300 million USD investment
- 600,000 SQM annual IC substrate capacity
- Tenting & SAP processes
- Advanced L/S 20/20μm, 10/10μm technology
- BT+ABF materials support
- Wire bonding substrates (BGA)
- Embedded memory IC substrates
- MEMS/CMOS modules
- RF, Wireless, Bluetooth modules
- 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
- Buildup technology with buried/blind vias
- Flipchip CSP packaging
Inquiry Requirements
For accurate quotations and technical support, please provide:
- Substrate production specifications
- Gerber files and drilling files
Shipping & Logistics
DHL, UPS, FedEx, air freight, and customized express services available.
Recommended Products
Price: US 95-120 per square meter
Price: US 0.1-0.12 each piece
Price: US 120-150 per square meter
Price: US 120-150 per square meter
Price: US 120-150 per square meter
Price: US 98-120 square meter
Price: US 0.1-0.12 each piece
Interested in this product?
Contact us now for more details and a custom quote.