4-Layer IC Substrate BT Material with 25μm Line Width and 0.22mm Thickness for Semiconductor Packaging
Professional 4-layer IC substrate with BT material, featuring 25μm minimum line width and 0.22mm finished thickness. Supports immersion gold surface finish and customizable options. HOREXS manufacturing with 600,000 SQM annual capacity and advanced L/S 20/20μm technology. Ideal for semiconductor packaging, wearable electronics, and storage IC applications.
- Semiconductor and IC package substrates
- IC substrate manufacturing
- Wearable electronics
- IC assembly systems
- Storage IC substrates
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.22mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others |
| Surface Finish | Mainly immersion gold, customizable options including OSP/immersion silver, tin, and more |
| Copper Weight | 0.5oz or customizable |
| Layer Count | 4 layers (customizable) |
| Soldermask | Green or customizable (Brand: TAIYO INK) |
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer located in Huangshi city, Hubei province, China. Our facility spans over 60,000 square meters with an investment exceeding $300 million USD.
- Annual IC Substrate Capacity: 600,000 SQM/Year
- Process Technologies: Tenting & SAP process
- Advanced Capabilities: L/S 20/20μm, 10/10μm
- Material Support: BT+ABF materials
- Wire bonding substrate (BGA)
- Embedded memory IC substrate
- MEMS/CMOS modules
- RF, Wireless, Bluetooth modules
- 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
- Buildup technology (Buried/Blind hole)
- Flipchip CSP and other ultra IC package substrates
To provide accurate pricing and technical support, please include the following information with your inquiry:
- Substrate production specifications
- Gerber files and drilling files (exported from layout software)
- Quantity requirements including samples
- For multilayer substrates: layer stack-up information
Large volume customers receive additional technical support and cost-saving solutions. Contact HOREXS today for competitive pricing and high-quality IC substrate manufacturing.
- Express: DHL, UPS, FedEx
- Air freight
- Custom express services (DHL/UPS/FedEx)
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