Thermal Phase Change Material
Thermal Phase Change Material 2.5W/mK 1.2g/cm3 PCM Interface Pad for Heat Sink
Low thermal resistance phase change material with 2.5W/mK conductivity and 1.2g/cm3 density. Solid at room temperature for easy installation, softens at 50-60°C to fill micro gaps. Non-conductive, low volatility, natural tacky. Ideal for CPUs, DC-DC converters, and power modules.
3.3g/cm3 5W/mK Thermal Phase Change Material PCM050 for High Power CPU GPU
Solid at room temperature for easy handling, LM-PCM050 softens at 55°C to fill micro gaps, achieving thermal conductivity of 5 W/mK. Ideal for microprocessors, GPUs, and power semiconductors. UL94 V0 rated, non-conductive, and available in custom thicknesses from 0.5-3.0 mm.
Phase Change Cooling Pad 3.5W/mK Thermal Conductive Gap Filler 0.1-0.5mm
Solid at room temperature for easy installation, this phase change pad softens at 55°C to fill micro gaps for superior thermal performance. Ideal for CPUs, GPUs, and power semiconductors. Offers 0.8-3.5 W/mK conductivity and operates from -40 to +220°C.
White PET Graphite Thermal Phase Change Material 0.065mm 1500W/mK
High thermal conductivity synthetic graphite film with 1500W/mK XY conductivity. Features white PET insulation, 0.065mm thickness, and RoHS/Halogen/REACH compliance. Customizable size and thickness for CPU heat dissipation.
Pink 2.2g/cc Microencapsulated Phase Change Material Thermal Pad 1.0 W/mK
LM-PCM100 phase change pad offers 0.024°C-in²/W thermal resistance and 1.0 W/mK conductivity. Naturally tacky, no adhesive or preheating needed. Reliable after 1000h@130°C and 500 thermal cycles from -25°C to 125°C. Ideal for CPUs, IGBTs, and memory modules.
Black Phase Change Thermal Interface Material 2.5W/mK Aluminum Foil Substrate 0.18mm
Solid at room temperature for easy handling, softens at 55°C to fill micro gaps for superior heat transfer. Non-conductive, 2.5W/mK thermal conductivity, 340MPa strength. Ideal for CPUs, GPUs, and power modules. Custom sizes available.
Grey Phase Change Thermal Pad 3.5W/mK 10.4MPa Heat Resistant Gap Filler for CPU GPU
High-performance phase change thermal pad with 3.5W/mK conductivity and 10.4MPa strength. Solid at room temperature for easy handling, softens at 55°C to fill micro gaps. Ideal for CPU, GPU, and power modules. UL94 V0 rated, non-conductive, customizable thickness.
80 Shore C 10.4Mpa Thermal Phase Change Material 0.8-3.5 W/m-K -40 to 220℃
Solid at room temperature, this organic phase change material softens at 50-60℃ to fill gaps between heat sinks and devices. Features low thermal resistance, natural tack, and low volatility (
0.01mm Thickness 2.5g/cc Thermal Phase Change Material 2.5W/mK
High-efficiency phase change material with 2.5W/mK thermal conductivity and 2.5g/cc density. Softens at 50-65°C, naturally tacky at room temperature. RoHS and UL compliant. Ideal for filling between PCBs, ICs, and heat sinks in communication, LED, and medical equipment. Custom thickness options available.
2.7g/cm3 0.6mm Thickness Thermal Phase Change Material 45-55°C Gap Filler
LM-PCM is a solid sheet that softens above 50°C to reduce thermal resistance between radiators and power electronics. Features 3 W/mK conductivity, 2.7g/cm3 density, and -40 to +130°C range. Custom thickness and color options available. Reliable, easy to handle.
49MPa 1.5W/mK Thermal Phase Change Material Pad 0.15mm Thickness
High-performance phase change material with 1.5W/mK thermal conductivity and 49MPa tensile strength. Fills interface gaps efficiently, naturally tacky at room temperature, no preheating required. RoHS, Halogen, and REACH compliant. Ideal for heat sink applications.
Self Adhesive Thermal Phase Change Material 2.85g/cc 3.0W/mK 0.005-0.127mm
High performance thermal phase change material with 3.0W/mK conductivity. Solid at room temperature, softens above 50°C to reduce thermal resistance. Inherently tacky, easy to use, and highly reliable for power electronic devices. UL94 V0 rated.
Phase Change Thermal Pad 2.0mm Thickness 12MPa Thermal Conductivity 3W/mK for Electronic Cooling
Solid at room temperature for easy installation, this phase change pad softens at operating temperature to fill gaps between heat sink and device. Offers excellent thermal conductivity, electrical insulation, and UL94 V0 flame retardancy. Customizable in size and color for various electronic applications.
0.5mm Thickness 1.9g/cm3 Thermal Phase Change Material Heat Sink Rubber Pad for Electronics
High thermal conductivity (3.0 W/mK) and low thermal resistance. Silicone-free, gray phase change material with 0.5mm thickness. Ideal for CPUs, GPUs, and power electronics. Custom sizes available. Free samples offered. RoHS compliant.
High Temperature Silicone Phase Change Material Sheet 2.5g/cm3 Density 2W/mK Thermal Conductivity
LM-PCM phase change material offers high thermal conductivity and low heat resistance for efficient heat transfer. Operating from -50 to 200°C, it thins under heat and pressure to reduce thermal resistance. Ideal for LEDs, automotive electronics, and power modules. UL94 V0 certified with customizable options.
Phase Change Thermal Pad 0.2mm Thickness 2.5W/mK Thermal Conductivity
Low thermal impedance of 0.035℃in2/w under low pressure. Solid at room temperature for easy installation, softens at 50-60℃ to fill gaps. Non-conductive, low volatility
3.4g/cm3 6W/m.K High Temperature Phase Change Silicone Sheet Thermal Interface Material
Solid at room temperature for easy handling, softens at 55°C to fill micro gaps for superior thermal performance. Offers 6W/m.K conductivity, UL94 V0 rating, and custom thickness options. Ideal for CPUs, GPUs, and power modules.
UL Green 1.8W/mK Phase Change Cooling Pad 0.15mm 0.25mm Thermal Material for Laptop Heat Transfer
Solid at room temperature for easy handling, softens at 55-65°C to fill gaps efficiently. Features 1.8W/mK thermal conductivity, 6000-8000V dielectric strength, and RoHS/REACH compliance. Ideal for laptop and electronics cooling with customizable thickness options.
3.0 W/mK Phase Change Thermal Interface Material 2.67 g/cm3 Grey Blue Sheet
LM-PCM300 offers very low thermal resistance for efficient heat transfer. Phase change at 50-60°C fills gaps for optimal contact. RoHS compliant, customizable thickness, and standard 240x240 mm sheets available.
Thermal Phase Change Material 80 Shore C 10.4Mpa Low Stress for High Temperature 0.8-3.5 W/m-K
Low heat resistance and low stress thermal pad with natural tacky, no glue needed. Operates from -40 to +220°C with phase change at 50-60°C. Low volatility under 1%, supports over 2000 thermal shock cycles. Ideal for high-temperature electronics.