MGP Mold

Showing 30 Products

Corrosion Resistant Semiconductor Mold Injection Molding Mould

Product Details: Semiconductor plastic sealing die is also known as plastic sealing die (MGP die). Chip encapsulation technology has gone through several generations of change, from to, dip, sop, qfp, bga to csp to mcm, encapsulation form by the traditional single chip encapsulation to the multi-chip encapsulation form of change, encapsulation form of change, resulting in the encapsulation mold application technology continues to improve, the traditional single injection of

Price: Negotiable MOQ: 1 set Delivery Time: 40 days

SOT26/223/89 MGP Packaging Mold For Semiconductor Injection Molding Mold

SOT26/223/89 MGP Mold Main packaging form: To series: T0220/263/247/252/3p, etc.; SOP series: SOP4/6/8/8/1 0/12/14/16/20/28;; DIP series: DIP4/8/14/16/18/23/24/25/29/40; SOT series: SOT23/25/26/223/89;; SOD series: S0D123/323/523/723/923; QFN/BGAPDFNOFP/SMA/MBF/TSSOP series, etc.; QFP/IPM series; Semiconductor device/chip/IC plastic seal. Product Description: MGP Mold: The Ultimate Solution for High-Quality Semiconductor Production MGP Mold is a leading manufacturer of high

Price: Negotiable MOQ: 1 set Delivery Time: 40 days

High Performance Durable DIP29/40 MGP Mold Tools Customized

DIP29/40 MGP Mold Product Description: MGP Mold - Your Ultimate Solution for High-Precision and High-Life Mold Welcome to MGP Mold, your reliable partner in providing high-quality, durable, and efficient mold solutions for various industries. MGP Mold is a leading manufacturer and supplier of semiconductor molds, catering to the needs of both local and international clients. Product Overview MGP Mold is a state-of-the-art product designed to meet the demands of high-precision

Price: Negotiable MOQ: 1 set Delivery Time: 40 days

Stainless Steel DIP40 MGP Mould Semiconductor Packaging Mold

DIP40 MGP Mold Main packaging form To series: T0220/263/247/252/3p, etc.; SOP series: SOP4/6/8/8/1 0/12/14/16/20/28;; DIP series: DIP4/8/14/16/18/23/24/25/29/40; QFN/BGAPDFNOFP/SMA/MBF/TSSOP series, etc.; QFP/IPM series; Semiconductor device/chip/IC plastic seal. Customization: MGP Mold Customization Services - TJIN 007 Brand Name: TJIN Model Number: 007 Place of Origin: China Certification: ISO9001 Minimum Order Quantity: 1 Packaging Details: Wooden Packaging Delivery Time:

Price: Negotiable MOQ: 1 set Delivery Time: 40 days

Aluminum DIP29 MGP Mold With Surface Polishing High Rigidity

DIP29 MGP Mold Main packaging form To series: T0220/263/247/252/3p, etc.; SOP series: SOP4/6/8/8/1 0/12/14/16/20/28;; DIP series: DIP4/8/14/16/18/23/24/25/29/40; SOT series: SOT23/25/26/223/89;; SOD series: S0D123/323/523/723/923; QFN/BGAPDFNOFP/SMA/MBF/TSSOP series, etc.; QFP/IPM series; Semiconductor device/chip/IC plastic seal. Product Description: MGP Mold - High-Precision and High-Quality Chip Packaging Solution MGP Mold is a highly specialized product designed for the

Price: Negotiable MOQ: 1 set Delivery Time: 40 days

DIP4/8/14/16/18/23/24/25/29/40 MGP Mold DME Base Nickel Plating

DIP4/8/14/16/18/23/24/25/29/40 MGP Mold Features: Product Name: IC Lead Frame Stamping Mold Mold Material: NAK80, S136, SKD61, Etc. Surface Treatment: Nickel Plating Runner System: Hot Runner/Cold Runner Mold Design: 3D/2D Material: Steel Semicon IC Lead Frame Mold High-Precision IC Lead Frame Mold High-Life IC Lead Frame Mold Technical Parameters: IC Lead Frame Stamping Mold Technical Parameters Mold Life 100,000 Shots Mold Cooling System Water Cooling Application IC Lead

Price: Negotiable MOQ: 1 set Delivery Time: 40 days

Lightweight SOT23 MGP Semiconductor Mould Customization Low Maintenance

SOT23 MGP mold Main packaging form To series: T0220/263/247/252/3p, etc.; SOP series: SOP4/6/8/8/1 0/12/14/16/20/28;; DIP series: DIP4/8/14/16/18/23/24/25/29/40; SOT series: SOT23/25/26/223/89;; SOD series: S0D123/323/523/723/923; QFN/BGAPDFNOFP/SMA/MBF/TSSOP series, etc.; QFP/IPM series; Semiconductor device/chip/IC plastic seal. Product Description: MGP Mold - High-Quality Mold for Semiconductor Industry Welcome to MGP Mold, the leading manufacturer of high-quality molds

Price: Negotiable MOQ: 1 set Delivery Time: 40 days

Industrial SOP4/6/8 MGP Semiconductor Mold Smooth Surface Finish

SOP4/6/8 MGP Mold Technical Parameters 1. Plastic dual -oil cylinder with a built -in gear shift drive multi -injection molding design; 2. The roughness of the cavity can achieve 0.2um.max; 3. Special products can increase the design of vacuum and built -in core pumping mechanisms; 4. According to the size of different lead frames, 8 tablets/12 pieces/16 tablets per mold can be achieved. Customization: High-Quality MGP Mold Customization Service Brand Name: TJIN Model Number:

Price: Negotiable MOQ: 1 set Delivery Time: 40 days

MBF / TSSOP Series Of Plastic Seal MGP Mold High Durability LKM Standard

MBF/TSSOP Series Of Plastic Seal Molds (MGP Molds) Technical Parameters 1. Plastic dual -oil cylinder with a built -in gear shift drive multi -injection molding design; 2. Cavity Bar uses high-speed powder steel, hardness HRC62-64; 3. Surface vacuum coating, the life span is not less than 300,000 times; 4. The roughness of the cavity can achieve 0.2um.max; 5. Special products can increase the design of vacuum and built -in core pumping mechanisms; 6. According to the size of

Price: Negotiable MOQ: 1 set Delivery Time: 40 days

Semiconductor MGP Mold Mirror Polishing And Ejector Sleeve For High Performance

Semiconductor MGP Mold Mirror Polishing and Ejector Sleeve for High-Performance Product Description: MGP Mold - High-Quality Mold for Electronic Products MGP Mold is a highly efficient and durable mold designed specifically for chip packaging in electronic products. With its superior quality and customizable design, MGP Mold is the perfect solution for your molding needs. Product Overview MGP Mold is a high-quality mold designed to meet the specific needs of electronic

Price: Negotiable MOQ: 1 Delivery Time: 40 days

Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing

DIP4 MGP Mold Technical Parameters 1. The roughness of the cavity can achieve 0.2um.max; 2. Special products can increase the design of vacuum and built -in core pumping mechanisms; 3. According to the size of different lead frames, 8 tablets/12 pieces/16 tablets per mold can be achieved. Technical Parameters: MGP Mold Technical Parameters Product Name High-Precision MGP Mold Application Semiconductor MGP Mold Ejection System Ejector Pin, Ejector Sleeve, Ejector Blade, Etc.

Price: Negotiable MOQ: 1 set Delivery Time: 40 days

MGP Mould With Mirror Polishing

500 Mold Life MGP Mold with Mirror Polishing and Ejector Sleeve Ejection System Product Description: MGP Mold - Your Ultimate Solution for High-Quality and High-Precision Mold in the Semiconductor Industry MGP Mold is a leading manufacturer of molds for the semiconductor industry. We specialize in producing high-quality and high-precision molds that are essential for the production of semiconductor components. Our molds are designed to meet the demanding requirements of the

Price: Negotiable MOQ: 1 Delivery Time: 40 days

SGS Certified MGP Mold

Control SGS Certified High-Life MGP Mold 50kg-10 Tons Weight Product Description: MGP Mold: The Ultimate Solution for High-Quality Semiconductor Production MGP Mold is a leading manufacturer of high-quality molds for the semiconductor industry. Our state-of-the-art facilities and advanced technology make us the top choice for companies looking for reliable and efficient mold solutions. Quality Control At MGP Mold, quality is our top priority. We are proud to be ISO9001:2015

Price: Negotiable MOQ: 1 Delivery Time: 40 days

Injection Molding MGP Mold

"TO220" Of MGP Mold Technical Parameters 1. Plastic dual -oil cylinder with a built -in gear shift drive multi -injection molding design; 2. Cavity Bar uses high-speed powder steel, hardness HRC62-64; 3. Surface vacuum coating, the life span is not less than 300,000 times; 4. The roughness of the cavity can achieve 0.2um.max; 5. Special products can increase the design of vacuum and built -in core pumping mechanisms; Customization: TJIN 007 Customized MGP Mold Service Brand

Price: Negotiable MOQ: 1 set Delivery Time: 40 days

Wear Resistant T0263/247/Plastic Seal MGP Mold For Semiconductor Manufacturing

Technical Parameters 1. Plastic dual -oil cylinder with a built -in gear shift drive multi -injection molding design; 2. Cavity Bar uses high-speed powder steel, hardness HRC62-64; 3. Surface vacuum coating, the life span is not less than 300,000 times; 4. The roughness of the cavity can achieve 0.2um.max; 5. Special products can increase the design of vacuum and built -in core pumping mechanisms; FAQ: Q: What is the brand name of this product? A: The brand name of this

Price: Negotiable MOQ: 1 set Delivery Time: 40 days

DIP Series Of Plastic Seal MGP Mold Tooling With Chrome Plating

DIP Series Of Plastic Seal Molds (MGP Molds) Technical Parameters 1. Plastic dual -oil cylinder with a built -in gear shift drive multi -injection molding design; 2. Cavity Bar uses high-speed powder steel, hardness HRC62-64; 3. Surface vacuum coating, the life span is not less than 300,000 times; 4. According to the size of different lead frames, 8 tablets/12 pieces/16 tablets per mold can be achieved. Applications: MGP Mold | TJIN Introduction MGP Mold, also known as Multi

Price: Negotiable MOQ: 1 set Delivery Time: 40 days

Single Or Multi Cavity MGP Molding Tool Mirror Polished QFN Series

QFN Series MGP Mold Product Technical Parameters 1. Plastic dual -oil cylinder with a built -in gear shift drive multi -injection molding design; 2. Cavity Bar uses high-speed powder steel, hardness HRC62-64; 3. Surface vacuum coating, the life span is not less than 300,000 times; 4. The roughness of the cavity can achieve 0.2um.max; 5. Special products can increase the design of vacuum and built -in core pumping mechanisms; 6. According to the size of different lead frames,

Price: Negotiable MOQ: 1 set Delivery Time: 40 days

Semiconductor Production MGP Mould Tool SOP Series Corrosion Resistance

SOP Series MGP Mold Features: Product Name: MGP Mold Design Software: UG, ProE, Solidworks, AutoCAD Gate Type: Edge Gate, Pin Point Gate, Sub Gate, Fan Gate, Etc. Cavity: Single Or Multi Mold Base: LKM, DME, HASCO Or Customized Cooling System: Water Cooling Or Air Cooling Semiconductor MGP Mold Chip Packaging MGP Mold Semiconductor MGP Mold Technical Parameters: Technical Parameters Value Mold Weight 50kg-10 Tons Gate Type Edge Gate, Pin Point Gate, Sub Gate, Fan Gate, Etc.

Price: Negotiable MOQ: 1 set Delivery Time: 40 days

DIP Series Plastic Seal MGP Mold Wear Resistance High Performance

DIP Series Of Plastic Seal Molds (MGP Molds) FAQ: Q: What is the brand name of this product? A: The brand name of this product is TJIN. Q: What is the model number of this product? A: The model number of this product is 007. Q: Where is this product made? A: This product is made in China. Q: Is this product certified? A: Yes, this product is certified with ISO9001. Q: What is the minimum order quantity for this product? A: The minimum order quantity for this product is 1 unit

Price: Negotiable MOQ: 1 set Delivery Time: 40 days

ISO9001 Certified SOD Series MGP Mold Plastic Seal Molds Hardness HRC62-64

SOD Series Of Plastic Seal Molds Technical Parameters 1. Plastic dual -oil cylinder with a built -in gear shift drive multi -injection molding design; 2. Cavity Bar uses high-speed powder steel, hardness HRC62-64; 3. Surface vacuum coating, the life span is not less than 300,000 times; 4. The roughness of the cavity can achieve 0.2um.max; 5. According to the size of different lead frames, 8 tablets/12 pieces/16 tablets per mold can be achieved. Features: Product Name: MGP

Price: Negotiable MOQ: 1 set Delivery Time: 40 days
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