ED Copper Foil
Low Profile Electrolytic Copper Foil
LP-S-B/R Low Profile Electrodeposited Electrolytic ED Copper Foil for FCCL FPC COF LED Low Profile Electrolytic Copper Foil Black Treatment 105um 70um 50um 35um 25um 12um 9um Matte side treatment low profile foil in back/red. Low Profile Electrolytic Copper Foil Balck treatment 105um 70um 50um 35um 25um 12um 9um Black Low Profile Electrolytic Copper Foil 105um 70um 50um 35um 25um 12um 9um Features: 1. The treated foil in gray or red 2. High profile with properties of LP-S-B
99.8% Purity 35um Hvlp Copper Foil for FCCL / FPC Application
Thickness 35um High Coarse Electrolytic Copper Foil for Special Resistance Material 99.8% Purity 35um Hvlp Copper Foil for FCCL / FPC Application Description: Purity:99.8% Roll ID: customization or 76 mm and 152 mm Thickness: 12 -70micron Width: 5mm-520 mm Length: 5000 M Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Main Category: Low profile Electrodeposited copper foil(LP-E) Very Low profile Electrodeposit
0.025mm Thick ED Copper Foil , Copper Foil 25 micron
0.025mm Thick ED Copper Foil , Copper Foil 25 micron Company Information JIMA has 20 years experience in copper foil industry, more than 27000 tons output yearly to meet the rising market requirement. In PCB, battery and shielding field, our copper foil leads the market as a material supplier. High quality product and sincere service is our fundamental to be existence and developing. Copper Specification Product name ED Copper Foil 25 Micron, Insulated Copper Foil 0.025mm
High Coarse Edco Copper Foil 5mm Width Circuit Board Copper Foil Sheet
ED Electrolytic Copper Foil with High Coarse for Double Face and Multiayer Printed Circuit Boards Overview: Range of Thickness: 0.012-0.070 mm Range of Width: 5-520 mm Range of Length: 500-5000 M Available ID: 76 mm,152 mman Purity:99.8% Features: Perfect normal temperature storage performance High temperature anti-oxidization performance High temperature elongation performance Being used in the production of the different double-face and multi-player printed circuit boards
3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
3 / 4 OZ Rolled Copper Foil,Copper Foil Paper for IC Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates and HDI(High-density-interconnect) boards Overview: We propose two kinds of copper foils and
3 / 4 OZ ED Copper Foil Flexible Copper Clad Laminate Good Folding Endurance
3/4 OZ good folding endurance VLP ED copper foil for Flexible Copper Clad Laminate. Specifications. - Matte side treatment low profile foil in back/red. - Thickness Range: 3/4OZ. - Width Range: 5-1380 mm. - Length: 500-5000 M. - ID: 76 mm,152 mm. - Cu Content: 99.8%. Products application: Casting and lamination type FCCL,Super fine pattern FPC&PWB, Chip on flex (COF) for LED. Packaging & Delivery. 1. Packaging Details:wooden carton. 2. Delivery Detail:25-30days,depend on
12um 18um 25um 35um ED Copper Foils For FPC Materials / EMI
ED Copper Foils 12um 18um 25um 35um for FPC Materials & EMI >. the treatment low profile foil in back/red. >. Thickness: 12~35µm >. Width: 200-1340mm >. Performances:The product surface is black or red, has lower surface roughness. >. Applications: Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film. Table1- Performance: Typical properties of Low Profile Copper Foil Classification Unit Requirement Test Method Nominal thickness / 12um 1/2 OZ
Red Low Profile ED Copper Foil 15um 18um 35um Used For Samsung Phone Heat Sink
Red Low Profile ED Copper Foil 15um 18um 35um Used For Samsung Phone Heat Sink Quickly details Matte side treatment low profile foil in back/red. Thickness: 15um,18um.35um Width: 1290mm, 640mm ID: 76 mm,152 mm Features: 1. the treated foil in grey or red 2. High profile with properties of LP-S-B/R suitable for FCCL 3. Grain structure of copper foil leads to high flexibility 4. Excellent etching performance 5. Very low profile enables to make fine circuit pattern Application:
PCB ED Electrolytic Copper Foil , 76Mm Copper Foil Roll
0.025mm Thick ED Copper Foil , Copper Foil 25 micron good flatness close to 100%, without stress or others that can influence the production Company Information JIMA has 20 years experience in copper foil industry, more than 27000 tons output yearly to meet the rising market requirement. In PCB, battery and shielding field, our copper foil leads the market as a material supplier. High quality product and sincere service is our fundamental to be existence and developing.
1 OZ ED Copper Foil For Special Conductivity Material Red / Black Color
1 OZ ED Copper Foil For Special Conductivity Material Red / Black Color Description: T: 12 micron-70micron W: 5-520 mm L: 500-5000 M Coil ID: 40/76 /152 mm Purity:99.8% Various kinds of Roughness,Low profile and good peel strength with resin,Good chemical resistance. Main Category: Standard Electrodeposited Copper Foil(STD-E), High Elongation Electrodeposited Copper Foil(HD-E), Copper foil for Lithium Cell, Low profile Electrodeposited copper foil(LP-E) Application: Special
70um Electrolytic ED Copper Foil Good Etch Ability Max 1380mm Width
70um ED electrolytic copper foil with High ductility ED copper foil for Shielding Industry Type Shielded ED Copper Foils Thickness Range 2oz to3oz(nominal thickness 70um105um); 8um-420um also available Width Range 1380(max) Performance Stay away from static electricity Restrain disturbance of electromagnetic wave Perfect performance of moisture resistance Thermal conductivity and UV-resistance Application Electronic products, construction Quality standard Reach the Ⅱ and Ⅲ
RTF Copper Foil 12um 18um 35um 70um 105um Reverse Treated Copper Foil For High Frequency & Multilayer Board
RTF Copper Foil 12um-105um,Reverse Treated Copper Foil For High Frequency & Multilayer Board Feature 1. Reverse Treated Copper Foil 2. Low profile 3. High MIT 4. Good etchability 5. the treated foil is pink 6. Shiny side treated Typical Application 1. Multilayer Board 2. High Frequency 3. EMI Size : Thickness:12-105um Width :200-1340mm,can be cutting as request Typical properties of Reverse Treated Copper Foil Classification Unit Requirement Test Method Nominal thickness /
25 Micron 99.9% Rolled ED Copper Foil For EMI Protection
0.025mm Thick ED Copper Foil , Copper Foil 25 micron Copper Specification Product name ED Copper Foil 25 Micron, Insulated Copper Foil 0.025mm Thick Copper foil thickness 25um,0.025mm Copper type ED Copper Foil for PCB, Li-ion Battery, MRI Room sheilding copper foil ,Insulated Copper content ≥ 99.9% Certification ISO 9001:2008, IPC-4562, RoHS MOQ One roll Cut roll width Customized Coil length and weight on request Characteristics High Temperature Elongation, Fine and Uniform
Phenolic Resin Board Nickel ED Copper Foil 0.5Oz Thickness
STD Standard ED Copper Foil For Phenolic Resin Board /copper nickel foil Quickly details Thickness: 0.012-0.070 mm Width: 5-520 mm Length: 500-5000 M ID: 76 mm,152 mm Alloy: T2,C11000,C1100,C101,E-Cu58 Temper: H Features: 1. the treated foil in gray or red 2. High peel strength 3. Good etch ability 4. Excellent adhesion to etching resist Application: 1. Phenolic resin board 2. Epoxy board Compare between CA copper foil and ED copper foil 1. Process: rolled copper foil
200 Degree 1N/Mm Thin ED Copper Foil 99.8% Purity None Pinholes
STD Standard ED Copper Foil For Phenolic Resin Board /copper nickel foil Copper foils, for the wide range of high frequency circuit substrates, are designed to provide optimum performance in high reliability applications. There are various types of copper foil are offered; in a range of weights (thicknesses). Their characteristics differ, and an understanding of these differences is important to ensure the correct selection of copper foil for each application or environmental
Graphene Carrier Copper Foil Paper FP Copper Foil 9um 12um 18um Thickness
Free Profile Copper Foil 9um 12um 18um 35um 70um ,FP Copper Foil For Graphene Carrier Prodent Feature 1. High tensile strength 2. High Elongation 3. Excellent etchability 4. Eco-friendly products and processes 5. free profile 6. the treated foil is pink Typical Application : Graphene Carrier Size detail : 1. Thickness: 9um 12um 18um 35un 70um 2. Width :200-1340mm,can be cutting as request,standard width is 1290mm 3. Sample can be supply Typical properties of Low Coarsening
Low Coarsening Reverse Treated Coppe Foil High Frequency For Fine Circuit Pattern
Low Coarsening Reverse Treated Coppe Foil 12um 18um 35um 50um 70um For Fine Circuit Pattern Prodent Feature 1. Reverse Treated Copper Foil 2. Low profile, with high peel strength 3. Excellent etchability 4. the treated foil is pink 5. Shiny side treated Typical Application High Frequency , Ultra-high Frequency;Fine Circuit Pattern; High Tg; applying to hydrocarbon board Size : Thickness: 12um 18um 35un 50um 70um Width :200-1340mm,can be cutting as request Typical properties
Red Or Gray 99.8% Purity ED Copper Foil for PCB Laminate Width 35um , 70um
ED Copper Foil with Width 35um, 70um for PCB laminate Quickly details 1>Thickness: 12um ~140um 2>standard Width: 1290mm 3>ID: 76 mm,152 mm 4>Sample:free provide A4 smaple as per thickness Application: 1. PCB laminate Compare between CA copper foil and ED copper foil 1. Process: rolled copper foil (Rolling process),ED copper foil (Electrodeposition process) 2. Strength toughness: rolled copper foil is a flaky crystalline structure, so the strength and toughness is better than
3 OZ Electrolytic Rolled Copper Foil , High Ductility Ultra Thin Copper Foil
3oz RED electrolytic High ductility copper foil There are various types of copper foil are offered; in a range of weights (thicknesses). Their characteristics differ, and an understanding of these differences is important to ensure the correct selection of copper foil for each application or environmental condition. Specifications: Thickness: 3ozWidth: 1380 mmLength: 500-5000 MInternal diameter: 76 mm and152 mmPurity:99.8% Crystalline StructureElectrodeposited copper crystals
105um High Ductility Thin Copper Foil For Epoxy Board High Peel Strength
105um High ductility copper foil for Epoxy board with High peel strength There are various types of copper foil are offered; in a range of weights (thicknesses). T: 12-105um W: 5-1380mm L: 500-5000 M ID: 76 mm,152 mm Purity:99.8% Features: . Good performance in Conductive. . High peel strength . Good etch ability Application: Polyimide board Difference between CA copper foil and ED copper foil Property Electrodeposited Rolled 8um 18um 35um 70um 18um 35um 70um Tensile strength