Company Cases
Company Cases
Explore our successful projects and client case studies.
Our Projects
34 Cases
2026-06-26
FS200A Doubles Throughput for Korean Smartphone Camera IR Filter Dust‑Capture and Reinforcement Process
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2026-06-25
AC100 Automates Diaphragm and Housing Mounting for Vietnamese Hearing‑Aid Inductor Production
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2026-06-17
AC100 Enables High‑Precision VCM Assembly for Indian Camera Module Manufacturers
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2026-06-17
SS200 Automated Lid Attach Line Improves FCBGA/FCCSP Yield for Malaysian Packaging Plant
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2026-06-16
GS700SU Enables High‑Throughput, Low‑Void FCBGA Bottom‑Fill for Texas AI/HPC Packaging Line
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2026-06-12
SS300 Enables First Domestic High‑Volume FoPLP Panel-Level Underfill Production for Taiwan Line
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2026-06-10
GS600SUA Enables First Domestic High‑Volume FCBGA Underfill Production for Malaysian Packaging Line
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2026-06-05
SS101 Enables First Domestic High‑Volume FoWLP Underfill Production for Penang Semiconductor Line
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2026-05-29
KSV1000 Enables Precise Micro-Drop Thread Locking for Indian Smartwatch Assembly
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2026-05-29
KDP0350 Enables Precise Thermal-Grease Dispensing for Taiwan AI Server Assembly
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2026-05-14
KSV3000 + Robot Integration Solves Thermal-Grease Dispensing for Malaysian Automotive Sensor Assembly
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2026-04-21
Overcoming MagSafe Wireless Magnetic Ring Displacement: 5-Axis Linkage Ensures 3D Path Consistency
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2026-04-16
Breakthrough in MEMS Production Stability: Minimizing Contamination Risks in ASIC Encapsulation
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2026-04-08
Targeting South Korea’s Smart Mobile Market: Optimizes Microphone Module Production Efficiency
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2026-04-08
Overcoming VCM Enameled Wire Burn-out: Mingseal Unveils DW200P Precision Welding Solution
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2026-04-08
Solving FPC Narrow-Pitch Dispensing: How Dual-Vision Real-Time Compensation Ensures 24/7 Zero-Deviation Operation
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2026-03-18
Solving Throughput Bottlenecks in Smartphone Camera Assembly: Asynchronous Dual-Head Mode for High UPH
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2025-12-04
An Advanced Solution for FCBGA and FCCSP Lid Attachment in Malaysia
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2025-12-04
The First Domestic Solution for Large Package Size FCBGA Bottom Filling in Texas, USA
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2025-11-25
VCM Intelligent Production Line – Transforming A-System VCM Manufacturing in Vietnam
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2025-11-25
Case Study: The First Domestic Solution for FCBGA Bottom Filling in Malaysia
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2025-11-18
SS101 Wafer-Level Dispensing System for FoWLP Packaging in Malaysia's Penang Market
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2025-11-17
The First Domestic Solution for FoPLP Panel-Level Encapsulation in Taiwan
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2025-11-17