LDI System
260mm x 810mm LDI System RTR315 for PCB HDI FPC - 15μm Resolution 380V Three-Phase
Professional Laser Direct Imaging system for PCB, HDI, and FPC manufacturing with 15μm resolution, 260mm x 800mm exposure size, and 380V three-phase power. Features roll-to-roll processing, ±12μm alignment accuracy, and eliminates phototool defects for superior circuit imaging quality and production efficiency.
RTR315 Laser Direct Imaging Equipment for PCB Manufacturing - 15μm Resolution, ±24μm Alignment, 260×800mm Exposure
Advanced LDI system for PCB, HDI, and FPC manufacturing with 15μm resolution and ±24μm alignment accuracy. Features automated UV-Mark alignment, 12-panel capacity, and supports Gerber 274X/ODB++ formats. ISO 9001 and CE certified for reliable industrial performance in mass production environments.
LD Laser LDI System 405nm 15μm Resolution for PCB HDI FPC Manufacturing with 260×800mm Exposure Size
Professional LD Laser LDI System with 405nm wavelength and 15μm resolution for precise PCB, HDI, and FPC manufacturing. Features 260×800mm exposure size, ±12μm alignment accuracy, and support for various plate types. Ideal for high-mix applications and mass production environments with automated solutions.
LDI Roll to Roll Direct Imaging PCB System 380V Three Phase - 15μm Resolution, 260×800mm Exposure
Advanced laser direct imaging system for PCB manufacturing with 15μm resolution and 260×800mm exposure size. Features 380V three-phase power, eliminates mask processes, reduces production costs, and delivers high precision alignment with ±12μm outer layer capability. Ideal for HDI, FPC, and mass production environments with automated operation.
ISO 9001 CE Certified 260mm x 800mm LDI System for Roll-to-Roll PCB, HDI, and FPC Applications with 15μm Resolution
Advanced laser direct imaging system featuring 260×800mm exposure size, 15μm resolution, and ±12μm alignment accuracy. Ideal for PCB, HDI, and FPC manufacturing with ISO 9001 and CE certifications. Supports automated production with comprehensive alignment modes and operates in controlled yellow light environments.
380V Three Phase Laser Direct Imaging System RTR315 - 15μm Resolution, 260×800mm Exposure Size for PCB HDI FPC Manufacturing
Advanced 380V three-phase LDI system with 15μm resolution and 260×800mm exposure capacity. Features UV-Mark alignment (±12μm outer layer), supports PCB/HDI/FPC applications, and operates in controlled environments. Ideal for high-precision PCB manufacturing with automated production capabilities.
RTR315 Roll-to-Roll PCB Laser Direct Imaging System with 15μm Resolution and 260×800mm Exposure Size
Advanced LDI system for PCB manufacturing featuring 15μm resolution, ±12μm outer layer alignment, and roll-to-roll processing. Eliminates phototool requirements while providing high precision for HDI, FPC, and standard PCB applications. Suitable for mass production with automated deviation adjustment capabilities.
HDI FPC PCB Laser Direct Imaging System 380V Three Phase with 15μm Resolution and 18×24" Capacity
Advanced LDI system for PCB, HDI, and FPC manufacturing featuring 15μm resolution, ±12μm alignment accuracy, and 380V three-phase power. Supports both RTR315 and DPX715T models with exposure sizes up to 620×810mm for precision circuit pattern definition.
RTR315 LDI System for Roll to Roll PCB with 15μm Resolution and 0.05-3.5mm Panel Thickness
High-precision laser direct imaging system for PCB, HDI, and FPC manufacturing. Features 15μm resolution, 260×800mm exposure size, and advanced UV-Mark alignment. Supports panel thickness from 0.05mm to 3.5mm with multiple deviation control modes for flexible production requirements.
RTR315 Roll to Roll Laser Direct Imaging Equipment 260x800mm with 15μm Resolution for PCB Manufacturing
Advanced roll to roll laser direct imaging system with 260×800mm exposure size and 15μm resolution for PCB, HDI, and FPC applications. Features UV-Mark alignment with ±12μm outer layer precision, 0.05-3.5mm panel thickness range, and automated deviation control for high-volume production environments.
15μm Roll-to-Roll LDI System for PCB Manufacturing - 20μm Resolution, 260×800mm Exposure Size, 380V Power
Advanced roll-to-roll LDI system with 15μm precision for FPC board production. Features automated continuous processing, 20μm resolution capability, ±10μm alignment accuracy, and seamless integration with development processes. Ideal for high-volume PCB manufacturing with reduced labor costs and improved reliability.