Laser Direct Imaging Machine
GIS Laser DPX230 Laser Direct Imaging Machine 0.05-7mm Board Thickness 610x710mm Exposure Area for PCB HDI FPC Manufacturing
High-precision laser direct imaging machine with 20μm alignment accuracy and 610mm×710mm exposure area. Features 405nm laser technology, multiple scale modes, and compatibility with 0.05-7mm board thickness. Ideal for PCB, HDI, and FPC production with superior speed and reliability for industrial applications.
GIS Laser DPX230 Laser Direct Imaging Machine with ±10μm Alignment Accuracy and 610×710mm Exposure Area
High-precision laser direct imaging system featuring ±10μm outer alignment accuracy, 25/25μm line resolution, and 610×710mm exposure area. Ideal for PCB, HDI, FPC, and ceramic substrate manufacturing with support for Gerber274x and ODB++ file formats. Includes traceability features and comprehensive technical support.
GIS Laser DPX230 Laser Direct Imaging Machine with 20μm Alignment Accuracy and 25/25μm Line Width for PCB Manufacturing
Advanced LDI system featuring 20μm inner alignment accuracy and 25/25μm line width/spacing for precision PCB, HDI, and FPC applications. Supports board thickness from 0.05mm to 7mm with Gerber274x and ODB++ file compatibility. Ideal for high-end manufacturing requiring exceptional precision and reliability.
GIS Laser DPX230 LDI Machine with 610mm×710mm Exposure Area and ±10μm Accuracy for PCB Manufacturing
High-precision laser direct imaging machine featuring 35s@24"×18" high sensing dry film, 25/25μm technology raster, and full table splicing exposure. Supports PCB, HDI, and FPC applications with multiple scale modes and traceable text/serial number capabilities. Ideal for industrial manufacturing requiring reliable laser printing solutions.
GIS Laser DPX230 Laser Direct Imaging Machine 610mm×710mm for 0.05-7mm PCB Board Thickness
Advanced laser direct imaging equipment with 610mm×710mm exposure area and ±10% line width tolerance. Supports PCB, HDI, and FPC manufacturing with 0.05-7mm board thickness capability. Features multiple scale modes, full table splicing exposure, and 25/25μm technology raster for high-precision circuit board production.
GIS Laser DPX230 LDI Machine with 610x710mm Exposure Area and ±10μm Alignment Accuracy for PCB Manufacturing
Advanced Laser Direct Imaging System featuring 25μm line width/spacing, ±10% line width tolerance, and support for Gerber274x/ODB++ formats. Designed for high-precision PCB, HDI, and FPC production with full table splicing exposure and multiple scale modes for optimal manufacturing efficiency.
GIS Laser DPX230 LDI Imaging System with 20μm Alignment Accuracy for 0.05-7mm Board Thickness
Industrial-grade Laser Direct Imaging System featuring 20μm inner alignment accuracy, 610mm×710mm exposure area, and support for 0.05-7mm board thickness. Ideal for PCB, HDI, and FPC manufacturing with multiple scale modes and high-speed precision imaging capabilities.