Wafer Frame Ring
Dura420 Stainless Steel Wafer Frame Ring 0.6-1.2 Inch with HRC48-55 Hardness for Laser Marking Protection
Professional mechanical polishing glossy wafer frame rings manufactured from Dura420/SUS420J2 stainless steel. Available in 0.6-1.2 inch sizes with surface hardness HRC48-55 and flatness
228mm Yellow Wafer Frame Ring SUS420J2 Stainless Steel with HRC48-55 Hardness for Semiconductor Protection
EASTAR® wafer frame rings provide essential protection for semiconductor wafers during laser marking processes. Made from SUS420J2 stainless steel with HRC48-55 hardness, these 1.2mm thick rings withstand high temperatures and prevent edge fragmentation. Available in 06", 08", and 12" sizes with customizable shapes for precise wafer handling and positioning requirements.
HRC48-55 Wafer Dicing Frame Ring with Mechanical Polishing Ra <0.15μm in 6", 8", 12" Sizes
Precision wafer dicing frame ring made from German Dura420 stainless steel with HRC48-55 hardness and mechanical polishing surface finish (Ra
SUS420J2 Wafer Metal Ring - HRC48-55 Hardness Stainless Steel Dicing Frame in 6/8/12 Inch Sizes
Precision SUS420J2 stainless steel wafer metal ring with HRC48-55 hardness and ±0.5mm tolerance. Provides edge protection for semiconductor wafers during UV laser marking and handling. Available in 6-inch (Ø228mm), 8-inch (Ø276mm), and 12-inch (Ø400mm) sizes with multiple surface finish options. Custom shapes available for semiconductor manufacturing applications.
Dura420 SUS420J2 Stainless Steel Wafer Dicing Ring HRC48-55 with 1.2mm Thickness for Semiconductor Processing
Professional EASTAR® wafer frame ring made from Dura420/SUS420J2 stainless steel with HRC48-55 surface hardness. Available in 6, 8, and 12-inch sizes with ±0.5mm tolerance and
EastStar Wafer Frame Ring 0.2mm Flatness SUS420J2 Stainless Steel for Semiconductor Dicing
Precision wafer frame ring with 0.2mm flatness and HRC48-55 hardness. Made from corrosion-resistant SUS420J2 stainless steel, this semiconductor component securely holds wafers during dicing, deposition, and packaging processes. Features ±0.5mm size tolerance and custom shape options for industrial manufacturing applications.
SUS420J2 Stainless Steel Wafer Frame Ring 6-12 Inch with HRC48-55 Hardness for Semiconductor Dicing
EASTAR ES-WFR-SUS420 wafer frame ring made from high-hardness SUS420J2 stainless steel with HRC48-55 surface hardness and ±0.5mm tolerance. Designed for semiconductor manufacturing, this durable ring securely holds wafers during laser marking, shipping, and handling operations with exceptional corrosion resistance and dimensional stability.
EASTAR Wafer Frame Ring ES-WFR-Dura420 - German Stainless Steel 6/8/12 Inch Dicing Ring with HRC48-55 Hardness
Precision wafer frame ring made from German Dura420 high-hardness stainless steel. Available in 6", 8", and 12" sizes with ±0.5mm tolerance and HRC48-55 surface hardness. Provides secure wafer protection during laser marking and processing with exceptional dimensional stability and corrosion resistance for semiconductor manufacturing applications.
HRC48-55 Stainless Steel Wafer Frame Ring 6-12 Inches for Semiconductor Processing
Precision wafer frame ring with HRC48-55 surface hardness and stainless steel construction. Features ±0.5mm tolerance, corrosion resistance, and multiple shape options for secure wafer handling in semiconductor manufacturing and research applications.
SUS420J2 Stainless Steel Wafer Frame Ring HRC48-55 Hardness 06/08/12 Inch Sizes for Semiconductor Protection
High-hardness SUS420J2 stainless steel wafer frame ring with HRC48-55 surface hardness and precise tolerances. Available in 06-inch (Φ228mm), 08-inch (Φ276mm), and 12-inch (Φ400mm) sizes with multiple surface finishes. Protects wafer and chip edges during UV laser marking and handling processes. Custom shapes and dimensions available for semiconductor manufacturing applications.
ES-WFR-Dura420 Wafer Dicing Frame Ring 1.5mm Thickness HRC48-55 Hardness ±0.5mm Tolerance
Precision wafer dicing frame ring made from German Dura420 stainless steel with HRC48-55 hardness and ±0.5mm tolerance. Features mechanical polishing with Ra
HRC48-55 Wafer Dicing Ring Frame - Dura420 Stainless Steel 6/8/12 Inch Sizes for Semiconductor Processing
Professional wafer dicing ring frames with HRC48-55 surface hardness, manufactured from Dura420/SUS420J2 stainless steel. Available in 6-inch (Φ228mm), 8-inch (Φ276mm), and 12-inch (Φ400mm) sizes with ±0.5mm tolerance. Provides edge protection during UV laser marking processes, preventing chip damage with customizable shapes and surface treatments.
228mm Metal Wafer Frame Ring SUS420J2 Stainless Steel for Wafer Dicing with HRC48-55 Hardness
Professional SUS420J2 stainless steel wafer frame ring with 228mm diameter, designed for wafer dicing and laser marking processes. Features HRC48-55 hardness, ±0.5mm tolerance, and withstands high-temperature UV laser operations. Available in multiple sizes with custom shape options for global wafer producers.
Mechanical Polishing Wafer Frame Ring 0.6-1.2 Inch Stainless Steel Dicing Frame HRC48-55
Professional stainless steel wafer frame rings in 0.6-1.2 inch sizes with mechanical polishing surface treatment (Ra