IC Chip Tray
Hiner-pack 2x2 Inch Waffle Pack Chip Trays 98 Cavities ESD Safe Stackable with Cover and Clip System
Hiner-pack 2x2 inch waffle pack chip trays with secure cover and clip system. Features 98 precision cavities, ESD-safe ABS material, and stackable design for secure microelectronic storage and shipping. RoHS and ISO certified. Accept OEM/ODM customization.
Permanently Conductive RoHS Waffle Pack Chip Tray 2 Inch 50.7x50.7x4mm
Molded from conductive ABS/PC resin for permanent ESD protection. Features 250 cavities, RoHS & ISO certified, cleanroom ready. Ideal for bare die, CSP, and sensitive microelectronics. Custom OEM/ODM supported.
Custom Geometry High Precision Waffle Pack Chip Trays 2 Inch 4 Inch for Non Standard Component Protection
Engineered for non-standard microelectronic components, these 2-inch and 4-inch waffle packs feature Moldflow analysis for superior precision and planar degree. Customizable pockets, permanent ESD integrity, and robust dimensional stability ensure safe handling of delicate parts. RoHS and ISO certified.
High Purity ESD Safe Waffle Pack Tray 50.7x50.7mm 400 Cavities for Optoelectronic Devices
Manufactured from non-sloughing, carbon-powder-free polymers for Class 100 cleanroom use. Permanent antistatic protection (10⁴-10¹¹ Ω) prevents contamination of sensitive optics. Customizable pocket geometry and stackable design. RoHS and ISO certified.
Permanent Antistatic 2 Inch Waffle Pack Chip Tray 48 Cavity ABS ESD
Permanent antistatic ABS waffle pack tray for R&D prototyping and batch assembly. 2x2 inch size with 48 precision cavities. Offers essential ESD protection, stackable design, and rapid customization. RoHS and ISO certified. Ideal for safe handling of bare die and CSPs.
Carbon Reinforced Waffle Pack Tray Flatness Under 0.3mm for 80°C to 120°C 900 Pocket
Engineered for extreme durability in high-volume automated handling. Carbon-fiber reinforced polymer ensures anti-warping and flatness under 0.3mm. Permanent ESD safety protects sensitive microelectronics. Customizable pocket geometry and bakeable options up to 180°C. Ideal for bare die, COG, and CSP packaging.
Custom 4 Inch 135 PCS Antistatic Waffle Chip Tray for Irregular Geometry Components
Precision-molded waffle tray for photonic and irregular semiconductor die. Features permanent antistatic protection, superior flatness, and custom pocket design. Ideal for Class 10-1000 cleanrooms, optical inspection, and safe global shipping. Durable, reusable, and fully customizable.
High Temperature ESD Safe 4 Inch Waffle Pack Tray 165 Pockets Carbon Fiber Reinforced
Engineered for demanding microelectronic thermal testing and automation. Carbon-fiber reinforced polymer ensures less than 0.3mm warpage and permanent ESD protection. Custom pocket geometries available for secure handling of larger components. Durable, stackable, and automation-ready.
Precision Molded Conductive PC Waffle Pack Chip Tray 4 Inch 20 Pocket for Semiconductor Die Storage
Engineered for secure semiconductor die storage and transport. Features a precision-molded conductive polymer for ESD protection, a compact 4-inch footprint, and a 20-pocket matrix. Durable, reusable, and customizable for irregular geometries. Ideal for bare die, CSPs, and photonic elements in back-end processes.
Matrix 10x20 Hard IC Chip Tray 200 Slots 50.8mm for Industrial Storage and Transport
This hard IC chip tray features a 10x20 matrix with 200 slots for secure storage and transport. Made of durable plastic, it supports cleanroom use and ultrasonic cleaning. Ideal for organizing integrated circuits in industrial applications.
Custom IC Chip Tray 50.7x50.7x5.60mm for Chips of Various Sizes
Durable injection-molded IC chip tray with surface resistance 1.0x10E4~1.0x10E11Ω. Standard and non-standard designs available. Lead time 10-15 days for mold production. Ideal for transport, storage, and packing in electronics manufacturing.
Reusable IC Chip Tray PC Material 3.00x2.40x0.65mm Cavity for IC Storage
Durable, reusable IC chip tray with PC material and flatness under 0.3mm. Injection molded, stackable, and heat resistant. Customizable for secure organization and storage of IC chips. Eco-friendly and cost-effective.
ABS PC IC Chip Tray 101.6x101.6x5.1mm 204pcs Capacity Chemical Resistant
Durable ABS and PC IC chip tray with antistatic and high-temperature resistance. Precision groove matrix protects chips during transport and storage. Chemical resistant, impact-resistant, and recyclable. Custom options available.
Customized Anti Static IC Chip Tray 165 PCS for Chip Storage and Transportation
Durable anti-static and dust-proof IC chip tray, model HN25030, holds 165 chips in an 11x15 matrix. Ideal for manufacturing, storage, and transport. Custom sizes available. ROHS certified, supports OEM/ODM.
101.6x101.6x4.5mm Hardness Integrated Circuit IC Chip Tray 169 Cavities for Professional Applications
Durable ABS IC chip tray with 169 independent cavities (4.4x4.8x1.13mm each) prevents component damage during handling and transport. Features permanent anti-static protection, ROHS certification, and flatness ≤0.3mm. Accepts OEM/ODM custom sizes and colors.
Hiner-pack 4 Inch IC Chip Tray 101.6x101.6mm Waffle Pack for Semiconductor Packaging
Durable HDPE waffle pack tray for safe handling of semiconductor die and chip scale components. Features 154 pockets (4.01x5.75x1.6mm), anti-static protection, and ISO 9001/SGS/ROHS certifications. Customizable for your specific needs.
Anti-Static IC Chip Tray 101.6mm Waffle Pack for Ultrasonic Cleaning 140 Cavities
Durable anti-static waffle pack for secure IC chip storage and transport. Features 140 precision cavities (7.2x4.75x1.5mm) in a compact 101.6mm tray. Ideal for wafer handling, die packaging, and ultrasonic cleaning. Customizable and available with fast 1-2 week delivery.
Reusable Black ESD IC Chip Tray 101.6x101.6x5.6mm 57PCS Waffle Pack
This reusable black ESD IC chip tray (waffle pack) offers strong chemical resistance and antistatic protection for sensitive microelectronics. With precise 14x5.2x0.32mm pockets and a 57PCS matrix, it ensures secure die packaging and transport. ISO 9001, SGS, ROHS certified. Lightweight, stackable, and customizable.
ESD IC Chip Tray 4 Inch Waffle Pack 101.6x101.6mm for Electronic Modules and Chips
Anti-static waffle pack for safe storage and transport of semiconductor chips. 5x7 matrix, 35 cavities. Stackable, lightweight, high-precision. Custom dimensions available. MOQ 1000pcs, delivery 1-2 weeks.
Customizable ESD IC Chip Tray 81 Cells 101.6x101.6mm RoHS Compliant
High-performance IC chip tray designed for safe storage and transport of integrated circuits. Features 81 pockets, anti-static ESD protection, and durable construction. Customizable per chip size. ISO 9001, SGS, RoHS certified. Ideal for semiconductor manufacturing and supply chain management.