IC Chip Tray
Special Inverted Components ESD Tray Anti Static 100PCS 50.7x50.7x4mm ROHS Certified ABS Material
Professional ESD tray designed for inverted components with 100PCS capacity and 50.7×50.7×4mm dimensions. Features anti-static protection (1.0×10⁴-1.0×10¹¹Ω), 0.2mm flatness, and ROHS certification. Ideal for wafer dies, PCBA modules, and optical devices with OEM/ODM customization options available.
Permanent Anti-Static Chip Trays for Tiny Dies 50.7x50.7x4mm with 0.46mm Cavity Size and 1.0x10⁴-1.0x10¹¹Ω Resistance
Professional permanent anti-static chip trays designed for tiny semiconductor dies with 50.7×50.7×4mm dimensions and 0.46×0.46×0.23mm cavity size. Features 1.0×10⁴-1.0×10¹¹Ω surface resistance, MAX 0.2mm flatness, and ROHS compliance. Ideal for wafer die, PCBA modules, and electronic component packaging with OEM/ODM customization available.
Black Plastic Waffle Pack Tray ESD 12PCS High Temperature 120-220°C 21.8x20.8mm
Professional ESD-protected waffle pack trays designed for semiconductor and electronic component packaging. Withstands high temperatures from 120°C to 220°C without deformation. Features 21.8x20.8mm pockets, ROHS/SGS certifications, and custom OEM options. Durable, reusable, and eco-friendly construction for industrial applications.
ESD Conductive IC Chip Tray 100pcs - Lightweight Waffle Pack for Electronic Components with 120°C Heat Resistance
Professional ESD conductive IC chip trays provide permanent antistatic protection for sensitive electronic components. Featuring 100-piece packs with excellent mechanical strength, chemical resistance, and automated equipment compatibility. ISO and RoHS certified with custom color options and 5-7 day sample lead time.
OEM Reusable Anti-Acid ESD Plastic Trays 2-4 Inch with 10^4-10^11Ω Surface Resistance
Small lightweight ESD plastic trays with anti-acid properties for electronic component packaging. Features 2-4 inch sizes, 0.2-0.3mm flatness, and permanent anti-static protection. ISO certified manufacturer with custom OEM/ODM options for semiconductors and embedded systems.
Antistatic PC Waffle Pack Chip Trays with 10⁴-10¹¹ Ohm Resistance for Lens Holder Components
Professional antistatic PC waffle pack chip trays featuring 10⁴-10¹¹ ohm surface resistance for superior ESD protection. These eco-friendly trays offer excellent mechanical strength, heat resistance, and chemical corrosion protection. Customizable in size, material, and color with CAD design support. Ideal for electronic component storage, packaging, and transportation with 10+ years OEM experience.
Eco-Friendly PC Standard IC Chip Tray Anti-Static Lens Holder Series - 2"/3"/4" Sizes with 10⁴-10¹¹Ω Resistance
Environmentally compliant IC chip trays with ROHS certification and anti-static protection (10⁴-10¹¹Ω surface resistance). Available in 2", 3", and 4" sizes with high temperature and corrosion resistance. Features matrix design for maximum capacity and edge chamfer for stacking accuracy. OEM/ODM services available.
Biodegradable Semiconductor Tray PC ESD 7.0×5.9×2.0mm ISO Certified Custom IC Packaging
Custom biodegradable semiconductor trays with ESD protection for IC and electronic components. Features 7.0×5.9×2.0mm pocket size, ISO certification, RoHS compliance, and custom design options. Durable, reusable, and eco-friendly packaging solutions for automation equipment compatibility.
IC Chip Tray Waffle Pack 101.57x101.57mm 180 Pockets for Semiconductor Storage and Transport
Durable, lightweight IC chip tray with 180 pockets (7.05x2.9x1.07mm each). Customizable design ensures perfect fit for various chips. ISO 9001, SGS, ROHS certified. Ideal for semiconductor, medical, and maintenance applications. MOQ 1000 pcs.
Black ABS Waffle Pack Chip Tray 50.7x50.7x4mm 20x20 Matrix for Optical Device Packaging
Durable black ABS waffle pack tray with 20x20 matrix (400 cavities) for optical device packaging. Features 0.95x1.25x0.46mm cavity size, flatness ≤0.2mm, and surface resistance 1.0x10e4-1.0x10e11Ω. ROHS certified, OEM/ODM available. Lightweight, recyclable, and cost-effective for semiconductor transport.
High Cleanliness Waffle Pack Chip Tray 4 Inch 68 Cavities for Small Bare Die Semiconductor
Precision-molded PC waffle tray with 68 cavities (14x3.32x0.3mm) for safe storage of small bare die. Features high cleanliness, flatness ≤0.2mm, and antistatic resistance. ISO and RoHS certified. Accepts OEM/ODM customization. Ideal for semiconductor and photoelectric applications.
Precision ESD IC Chip Tray 50.7x50.7mm 100 Cavities for Semiconductor Storage
Engineered with precision cavities to secure delicate ICs, offering reliable ESD protection from 1.0x10⁴ to 1.0x10¹¹ Ω. Durable, wear-resistant design supports automated production. Fully customizable cavity layout. ISO certified and RoHS compliant for industrial use.
ESD-Safe IC Chip Tray 50.8x50.8mm Precision Cavity for Semiconductor Storage
Durable ESD-safe tray with precision cavity layout protects delicate IC chips from shifting and electrostatic damage. Resistance 1.0×10⁴-1.0×10¹¹ Ω, max warpage 0.21mm. ISO certified, RoHS compliant. Custom cavity sizes and OEM/ODM available for automated packaging lines.
ESD Waffle Pack Tray 272 Cavities 50.7mm Precision Grid for IC Chip Packaging
Durable high-temp ESD waffle tray with precision grid design for secure IC chip handling. Features 272 cavities, 1.0×10⁴–1.0×10¹¹ Ω resistance, and ISO/RoHS compliance. Supports fully customized cavity sizes and layouts for automated packaging and cleanroom workflows.
Square ESD IC Chip Tray 101.6x101.6mm Waffle Pack with Lids and Clips
High-precision ESD IC chip tray with 143 pockets (5.95x4.7x1.3mm each). Made from anti-static polymer, it ensures secure storage and transport. ISO 9001, SGS, ROHS certified. Custom options available. MOQ 1000 pcs, delivery 1-2 weeks.
Stackable Conductive Waffle Pack Chip Trays 50.8x50.8mm 100 Cavity ESD Protection
Permanently conductive ABS/PC trays with precision ribbed matrix for crush-proof stacking. 100 cavities per tray, 10^4-10^11 Ω resistance. RoHS certified, OEM/ODM supported. Ideal for fragile semiconductor component shipping.
2 Inch Waffle Pack Chip Tray 56 Cavity ESD ABS for Automated Pick and Place Systems
Permanent antistatic ABS waffle pack with 56 cavities (8.22x1.88x0.30mm). Anti-migration design, RoHS compliant, and cleanroom-ready. Ideal for high-speed SMT and die sorting. Accepts OEM/ODM customization.
Permanent ESD Conductive ABS Waffle Pack Chip Tray 50.7x50.7mm 100 Cavities for Microchip Storage
Permanent ESD safe conductive ABS waffle pack tray for microchip storage and transport. Features 100 precision cavities, dimensional stability, and non-sloughing cleanroom readiness. RoHS and ISO certified. Supports OEM/ODM customization for automated handling and secure stacking.
2 Inch Waffle Pack Chip Tray 50.7x50.7mm ESD Conductive ABS for Microelectronic Component Alignment
High-precision 2-inch waffle pack tray with Moldflow-optimized design for superior flatness and dimensional accuracy. Features permanent ESD protection, 250 pockets, and RoHS/ISO certification. Ideal for die sorting, inspection, and automated handling. Supports OEM/ODM customization.
Permanent Antistatic Waffle Pack Chip Tray 50.7x50.7x5.5mm 56 Cavities
Permanent antistatic PC waffle pack tray with 56 precision cavities for safe storage and transport of small, fragile parts. Features superior flatness, RoHS/ISO compliance, and OEM/ODM customization. Ideal for semiconductor, medical, and aerospace applications.