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Two-layer, 5 mil high-frequency Taconic RF-35TC PCB Thermally Conductive Low-Loss Laminate 2024-09-27

Two-layer, 5 mil high-frequency Taconic RF-35TC PCB Thermally Conductive Low-Loss Laminate

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F4BTM300 PCB, a rigid PCB material with immersion gold for radar, microwave, and radio systems 2024-09-27

F4BTM300 PCB, a rigid PCB material with immersion gold for radar, microwave, and radio systems

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2-Layer Woven Glass Reinforced PTFE PCB on 30mil Rogers AD250C Substrates with Immersion Gold 2024-09-26

2-Layer Woven Glass Reinforced PTFE PCB on 30mil Rogers AD250C Substrates with Immersion Gold

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Assembly of Taconic TRF-45 High Frequency PCB with HASL Finish and 1 oz of copper on 32 mil 0.813 mm substrates 2024-01-31

Assembly of Taconic TRF-45 High Frequency PCB with HASL Finish and 1 oz of copper on 32 mil 0.813 mm substrates

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Wangling TP2000 High Dk PCB Using Immersion Gold and 1 oz of Copper Built on 10mm Substrates 2024-01-31

Wangling TP2000 High Dk PCB Using Immersion Gold and 1 oz of Copper Built on 10mm Substrates

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The Rogers TMM10i High Frequency PCB is constructed using immersion tin and double-sided copper on 50 mil 1.27 mm substrates 2024-01-31

The Rogers TMM10i High Frequency PCB is constructed using immersion tin and double-sided copper on 50 mil 1.27 mm substrates

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Double-sided copper layer on a 25 mil, 0.635 mm substrate is used to build the Rogers TMM 10 PCB 2024-01-31

Double-sided copper layer on a 25 mil, 0.635 mm substrate is used to build the Rogers TMM 10 PCB

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Built on 60mil 1.524mm Substrates with Double Layer Copper and HASL, the TMM 3 Rogers Thermoset PCB 2024-01-31

Built on 60mil 1.524mm Substrates with Double Layer Copper and HASL, the TMM 3 Rogers Thermoset PCB

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PCB for Rogers TC350 Constructed on 20 mil 0.508 mm High Thermal Conductivity Substrates with Immersion Tin and Double Sided Copper 2024-01-31

PCB for Rogers TC350 Constructed on 20 mil 0.508 mm High Thermal Conductivity Substrates with Immersion Tin and Double Sided Copper

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S1000-2M Impedance PCB with Blind Via and Immersion Gold, Constructed on 4-Layer Copper 2024-01-31

S1000-2M Impedance PCB with Blind Via and Immersion Gold, Constructed on 4-Layer Copper

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Composed of 30 mil 0.762 mm laminates with immersion silver and double layer copper, the Rogers RT/duroid 6035HTC PCB 2024-01-31

Composed of 30 mil 0.762 mm laminates with immersion silver and double layer copper, the Rogers RT/duroid 6035HTC PCB

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Built on 50mil 1.27mm laminates with double-sided copper and immersion silver, the RT/duroid 6010.2LM Rogers PCB 2024-01-31

Built on 50mil 1.27mm laminates with double-sided copper and immersion silver, the RT/duroid 6010.2LM Rogers PCB

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RT/duroid 6010.2LM High Frequency PCB with Double Layers and Immersion Gold Built on 25mil 0.635mm Substrate 2024-01-31

RT/duroid 6010.2LM High Frequency PCB with Double Layers and Immersion Gold Built on 25mil 0.635mm Substrate

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Double-sided and bare copper Rogers RT/duroid 5870 RF PCB, constructed on 31 mil 0.787 mm 2024-01-31

Double-sided and bare copper Rogers RT/duroid 5870 RF PCB, constructed on 31 mil 0.787 mm

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With a 20 mil 0.508 mm core, double-sided copper, and immersion gold, the RO4533 high-frequency printed circuit board is built 2024-01-31

With a 20 mil 0.508 mm core, double-sided copper, and immersion gold, the RO4533 high-frequency printed circuit board is built

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The RO4003C PCB has double layer buildup and immersion gold and is constructed on 60 mil 1.524 mm substrates 2024-01-30

The RO4003C PCB has double layer buildup and immersion gold and is constructed on 60 mil 1.524 mm substrates

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Utilizing 32 mil 0.813 mm laminates with immersion gold and double layer copper, the Rogers RO4003C PCB is constructed 2024-01-30

Utilizing 32 mil 0.813 mm laminates with immersion gold and double layer copper, the Rogers RO4003C PCB is constructed

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HASL Finish and Double Sided Copper on a 20 mil 0.508 mm laminate platform for the RO4003C High Frequency PCB 2024-01-30

HASL Finish and Double Sided Copper on a 20 mil 0.508 mm laminate platform for the RO4003C High Frequency PCB

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12 mil core hybrid PCB (RO4003C) with a 6-layer stackup, via-filled, and sealed 2024-01-18

12 mil core hybrid PCB (RO4003C) with a 6-layer stackup, via-filled, and sealed

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RO3010 RF Circuit Board Constructed on HASL and 4-Layer Structured 50mil 1.27mm Substrates 2024-01-18

RO3010 RF Circuit Board Constructed on HASL and 4-Layer Structured 50mil 1.27mm Substrates

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RF PCB RO3003 Built with a 0.127mm core and a 6-layer structure that includes impedance control and immersion gold 2024-01-18

RF PCB RO3003 Built with a 0.127mm core and a 6-layer structure that includes impedance control and immersion gold

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Rogers Ceramic PTFE Dual Layer RF PCBs with Immersion Gold, Built on 50 mil 1.27 mm RT/duroid 6006 2024-01-12

Rogers Ceramic PTFE Dual Layer RF PCBs with Immersion Gold, Built on 50 mil 1.27 mm RT/duroid 6006

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IPC-Class 2 compliant double-sided Rogers ceramic PTFE high frequency printed circuit board constructed on 30 mil 0.762 mm ro3035 substrates 2024-01-12

IPC-Class 2 compliant double-sided Rogers ceramic PTFE high frequency printed circuit board constructed on 30 mil 0.762 mm ro3035 substrates

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Taconic RF-60TC High Frequency PCB is constructed on 30mil 0.762mm laminates with double-layered copper and immersion gold 2024-01-12

Taconic RF-60TC High Frequency PCB is constructed on 30mil 0.762mm laminates with double-layered copper and immersion gold

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