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IR Picosecond Laser

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50W Picosecond Infrared Laser 1000uJ Maximum Burst Energy For Precision Processing

Infrared Picosecond Laser(50W) is used in precision processing applications such as silicate glass cutting, high-borosilicate glass tube cutting, high-transmission brittle material engraving, and metal microporation, etc. The unique zoned modular unit combination design and the stable and simple OEM system integration design provide the whole system with good temperature adaptability and simple operation, and the fully-enclosed design supports the use of the lasers in a

Price: Negotiable MOQ: 1 unit Delivery Time: Negotiable

Infrared 40W Pico Second Laser With Oned Modular Unit Combination Design

Infrared Picosecond Laser(40W) is used in precision processing applications such as silicate glass cutting, high-borosilicate glass tube cutting, high-transmission brittle material engraving, and metal microporation, etc. The unique zoned modular unit combination design and the stable and simple OEM system integration design provide the whole system with good temperature adaptability and simple operation, and the fully-enclosed design supports the use of the lasers in a

Price: Negotiable MOQ: 1 unit Delivery Time: Negotiable

Energy Efficiency 45W Picosecond UV Laser With Stable Integration System

Infrared Picosecond Laser(45W) is used in precision processing applications such as silicate glass cutting, high-borosilicate glass tube cutting, high-transmission brittle material engraving, and metal microporation, etc. The unique zoned modular unit combination design and the stable and simple OEM system integration design provide the whole system with good temperature adaptability and simple operation, and the fully-enclosed design supports the use of the lasers in a

Price: Negotiable MOQ: 1 unit Delivery Time: Negotiable

High Efficiency 30W Picosecond Infrared Laser With Temperature Adaptability

Infrared Picosecond Laser(30W) is used in precision processing applications such as silicate glass cutting, high-borosilicate glass tube cutting, high-transmission brittle material engraving, and metal microporation, etc. The unique zoned modular unit combination design and the stable and simple OEM system integration design provide the whole system with good temperature adaptability and simple operation, and the fully-enclosed design supports the use of the lasers in a

Price: Negotiable MOQ: 1 unit Delivery Time: Negotiable

Simple Operation 35W Picosecond Infrared Laser With Fully Enclosed Design

Infrared Picosecond Laser(35W) is used in precision processing applications such as silicate glass cutting, high-borosilicate glass tube cutting, high-transmission brittle material engraving, and metal microporation, etc. The unique zoned modular unit combination design and the stable and simple OEM system integration design provide the whole system with good temperature adaptability and simple operation, and the fully-enclosed design supports the use of the lasers in a

Price: Negotiable MOQ: 1 unit Delivery Time: Negotiable