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III-V Chiplet Integration on 300mm RF Silicon Interposers: InP, GaAs and GaN Die Bonding, Surface Flatness and Thermal M 2026-09-09

III-V Chiplet Integration on 300mm RF Silicon Interposers: InP, GaAs and GaN Die Bonding, Surface Flatness and Thermal M

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AlScN-on-Silicon Wafers for RF Filters and Ferroelectric Memory: Scandium Content, Film Stress, Crystal Polarity and Waf 2026-09-09

AlScN-on-Silicon Wafers for RF Filters and Ferroelectric Memory: Scandium Content, Film Stress, Crystal Polarity and Waf

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AI Is Pushing Semiconductors Into a New Materials Era: SOI, Glass, SiC, GaN and Advanced Thermal Materials 2026-09-08

AI Is Pushing Semiconductors Into a New Materials Era: SOI, Glass, SiC, GaN and Advanced Thermal Materials

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InP Wafer Doping Guide: Fe-Doped Semi-Insulating vs S/Sn-Doped N-Type vs Zn-Doped P-Type Substrates 2026-09-02

InP Wafer Doping Guide: Fe-Doped Semi-Insulating vs S/Sn-Doped N-Type vs Zn-Doped P-Type Substrates

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Silicon Wafer Diameter and Thickness Guide: 100mm, 150mm, 200mm and 300mm Standards, Typical Thickness and Applications 2026-09-02

Silicon Wafer Diameter and Thickness Guide: 100mm, 150mm, 200mm and 300mm Standards, Typical Thickness and Applications

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Why Is Silicon Carbide Ceramic So Difficult to Densify? A Guide to SiC Sintering Technologies 2026-09-02

Why Is Silicon Carbide Ceramic So Difficult to Densify? A Guide to SiC Sintering Technologies

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Sapphire Boule Inspection Before Wafer Processing: Crystal Orientation, Bubble Defects, Stress and Usable Yield 2026-08-28

Sapphire Boule Inspection Before Wafer Processing: Crystal Orientation, Bubble Defects, Stress and Usable Yield

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P-Type vs N-Type Germanium Wafers: Dopants, Resistivity, Carrier Mobility and Infrared Applications 2026-08-28

P-Type vs N-Type Germanium Wafers: Dopants, Resistivity, Carrier Mobility and Infrared Applications

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High-Purity SiC Powder for Crystal Growth: Purity Levels, Particle Size, Impurity Control and PVT Yield 2026-08-28

High-Purity SiC Powder for Crystal Growth: Purity Levels, Particle Size, Impurity Control and PVT Yield

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Why High-Purity Quartz Has Become a Semiconductor Supply-Chain Issue 2026-08-21

Why High-Purity Quartz Has Become a Semiconductor Supply-Chain Issue

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Why Sapphire Is Becoming More Important in MicroLEDs and Advanced Optical Systems 2026-08-21

Why Sapphire Is Becoming More Important in MicroLEDs and Advanced Optical Systems

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Silicon Carbide Is Moving Toward 12-Inch Wafers. So Why Are Some Plants Closing? 2026-08-21

Silicon Carbide Is Moving Toward 12-Inch Wafers. So Why Are Some Plants Closing?

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AI Servers Are Consuming Enormous Amounts of Power: Could Silicon Carbide Enter Its Second Golden Market? 2026-08-12

AI Servers Are Consuming Enormous Amounts of Power: Could Silicon Carbide Enter Its Second Golden Market?

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The 300mm SiC Wafer Race Has Begun: Silicon Carbide Enters Its Next Industrial Era 2026-08-07

The 300mm SiC Wafer Race Has Begun: Silicon Carbide Enters Its Next Industrial Era

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Production, Research or Dummy Grade SiC Wafers: Which Grade Should Buyers Specify? 2026-07-29

Production, Research or Dummy Grade SiC Wafers: Which Grade Should Buyers Specify?

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SiC Wafer Off-Axis Angle Guide: How 0°, 4° and 8° Miscut Affect Epitaxy and Device Yield 2026-07-29

SiC Wafer Off-Axis Angle Guide: How 0°, 4° and 8° Miscut Affect Epitaxy and Device Yield

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Semi-Insulating GaN Wafers for RF Devices: Resistivity, TDD and RFQ Checklist 2026-07-29

Semi-Insulating GaN Wafers for RF Devices: Resistivity, TDD and RFQ Checklist

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How Micropipes and Basal Plane Dislocations Affect SiC Substrate Performance 2026-07-15

How Micropipes and Basal Plane Dislocations Affect SiC Substrate Performance

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SiC Wafer Processing Challenges: Grinding, Polishing and Surface Defects 2026-07-10

SiC Wafer Processing Challenges: Grinding, Polishing and Surface Defects

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Wafer Dicing Process Explained: From Silicon Wafer to Individual Chips 2026-07-10

Wafer Dicing Process Explained: From Silicon Wafer to Individual Chips

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FOUP in Semiconductor Manufacturing: Meaning, Structure, Materials and Applications 2026-07-06

FOUP in Semiconductor Manufacturing: Meaning, Structure, Materials and Applications

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Quartz Flanges, Rings and Bases: Small Quartz Parts Used in Semiconductor Equipment 2026-07-03

Quartz Flanges, Rings and Bases: Small Quartz Parts Used in Semiconductor Equipment

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Four Critical Semiconductor Materials Powering the Future of AI Infrastructure 2026-06-22

Four Critical Semiconductor Materials Powering the Future of AI Infrastructure

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Semi-Insulating vs Conductive SiC Wafers: Key Differences Explained 2026-06-16

Semi-Insulating vs Conductive SiC Wafers: Key Differences Explained

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