EMMC Memory Chip
KLMBG2JETD-B041 32GB eMMC 5.1 Memory Chip with BGA153 Socket and HS400 Interface
High-performance 32GB eMMC 5.1 memory chip featuring BGA153 socket compatibility, HS400 interface for fast data transfer, and wide operating temperature range (-40°C to 85°C). Ideal for industrial applications requiring reliable storage with dual voltage support (1.8V/3.3V) and industrial-grade durability.
KMQN1000SM-B316 eMMC Memory Chip 8GB Storage BGA211 Package for Mobile Devices
High-performance 8GB eMMC memory chip in BGA211 package, designed for mobile devices and embedded systems. Features eMMC 5.1 interface, 3.3V operating voltage, and industrial-grade reliability. Ideal for smartphones, tablets, and IoT applications requiring compact, efficient storage solutions.
KLMCG8WEBD-B031 64GB eMMC Memory Chip BGA Package 1.8V/3.3V Gen6 for PC and Mobile Storage
64GB eMMC 5.0 memory chip with HS400 interface and dual voltage support (1.8V/3.3V). Compact 11.5 x 13 x 1.0 mm BGA package operates from -25°C to 85°C. Ideal for personal computers and mobile storage applications requiring efficient power consumption and reliable performance.
KLMCG4JETD-B041 64GB eMMC 5.1 Memory Chip with HS400 Interface and BGA Package for Industrial Applications
High-performance 64GB eMMC 5.1 memory chip featuring HS400 interface, dual voltage operation (1.8V/3.3V), and extended temperature range (-25°C to 85°C). Ideal for industrial automation, embedded systems, and IoT devices requiring reliable storage with BGA package compatibility.
KLMBG4WEBD-B031 32GB eMMC Memory Chip BGA Package 11.5x13mm with HS400 Interface for Mobile Storage
32GB eMMC 5.0 memory chip with HS400 interface and BGA packaging. Features 1.8V/3.3V dual voltage, -25°C to 85°C operating range, and superior power efficiency for mobile storage applications. Compact 11.5 x 13 x 1.0 mm size enables slim device designs.
H26M41204HPR 8GB Embedded MultiMedia Card eMMC Storage FBGA153 Package with 3.3V/1.8V Operation
Industrial-grade 8GB eMMC storage chip with FBGA153 package, supporting -40℃ to 85℃ temperature range and advanced firmware features including HS400 interface, health monitoring, and secure write protection. Ideal for embedded systems requiring reliable data storage with extended operational capabilities.
THGBMHG6C1LBAIL NAND 64gb Emmc Flash Memory IC 64Gb ( 8G X 8 ) MMC 52MHz 153-WFBGA
EMMC Memory Chip THGBMDG5D1LBAIT 32GB IC FLASH 32G MMC 52MHZ 153WFBGA Memory Chip Storage General Information: Item NO. THGBMDG5D1LBAIT Version JEDEC 5.1 Density 64GB Categories Integrated Circuits (ICs) Memory Manufacturer Toshiba Memory America, Inc. Series e•MMC™ Packaging Tray Part Status Active Memory Type Non-Volatile Memory Format FLASH Technology FLASH - NAND Memory Size 64Gb (8G x 8) Clock Frequency 52MHz Memory Interface MMC Voltage - Supply 2.7 V ~ 3.6 V Operating
KLMBG4GESD-B03P 32GB eMMC 5.0 Flash Storage Chip with 1.8V/3.3V Dual Voltage and BGA153 Package
High-performance 32GB eMMC 5.0 flash storage chip featuring HS400 interface and dual voltage support (1.8V/3.3V). Designed with BGA153 package for mobile devices and embedded systems, operating in extended temperature range from -40°C to 85°C for reliable industrial applications.
KLMDG8JEUD-B04Q 128GB eMMC 5.1 Memory Chip with HS400 Interface and BGA153 Package
Industrial-grade 128GB eMMC 5.1 memory chip featuring HS400 interface for high-speed data transfer. Operates at 1.8V/3.3V dual voltage with extended temperature range (-40°C to 105°C). BGA153 package design ensures reliable performance for notebook computers and embedded systems in mass production environments.
KLM4G1FETE-B041 4GB eMMC 5.1 Memory Chip with HS400 Interface and BGA153 Package
High-performance 4GB eMMC 5.1 memory chip featuring HS400 interface for fast data transfer, dual voltage support (1.8V/3.3V), and industrial temperature range (-25°C to 85°C). BGA153 package ensures reliable mounting for desktop PC and embedded system applications requiring durable storage solutions.
KLMBG4WEBD-B031 32GB eMMC 5.0 Memory Chip 11.5×13×0.8mm HS400 Interface for Notebook Applications
Compact 32GB eMMC 5.0 memory chip with HS400 interface, operating at 1.8V/3.3V voltage and -25°C to 85°C temperature range. Features 11.5×13×0.8mm package size ideal for notebook and embedded systems. Note: Product has reached End of Life status.
KLMAG2GESD-B03P 16GB eMMC 5.0 Memory Chip with HS400 Interface and BGA153 Socket
16GB eMMC 5.0 memory chip featuring HS400 high-speed interface, dual voltage support (1.8V/3.3V), and extended temperature range (-40°C to 85°C). Ideal for laptops, desktops, and embedded systems requiring reliable storage with BGA153 package compatibility.
THGBMDG5D1LBAIT IC 32gb Emmc Flash Memory Drive Laptop MMC 52MHZ 153WFBGA
EMMC Memory Chip THGBMDG5D1LBAIT 32GB IC FLASH 32G MMC 52MHZ 153WFBGA Memory Chip Storage General Information: Item NO. THGBMDG5D1LBAIT Version JEDEC 5.0 Density 32GB Categories Integrated Circuits (ICs) Memory Manufacturer Toshiba Memory America, Inc. Series e•MMC™ Packaging Tray Part Status Active Memory Type Non-Volatile Memory Format FLASH Technology FLASH - NAND Memory Size 32Gb (4G x 8) Clock Frequency 52MHz Memory Interface MMC Voltage - Supply 2.7 V ~ 3.6 V Operating
KLM8G1GESD-B03Q 8GB eMMC 5.0 Memory Chip with HS400 Interface and BGA153 Package for Industrial Applications
Industrial-grade 8GB eMMC 5.0 memory chip featuring high-speed HS400 interface, wide operating temperature range (-40°C to 105°C), and dual voltage support (1.8V/3.3V). Compact BGA153 package design ensures reliable performance in demanding industrial environments with superior data transfer capabilities and robust construction.
KLM8G1GESD-B03P 8GB eMMC 5.0 Flash Memory Chip with HS400 Interface and BGA153 Package
8GB eMMC 5.0 flash memory chip featuring HS400 high-speed interface and dual voltage operation (1.8V/3.3V). Designed for personal computer storage with BGA153 package, extended temperature range (-40°C to 85°C), and reliable data retention for industrial applications.