Sintering Die Bonder SDB 200
Sintering Die Bonder SDB 200 Product Specifications Attribute Value Model SDB 200 Machine dimension 1050(L)*1065(W)*1510(H)mm Equipment net weight Approx.900kg Placement accuracy ±10um Placement angle deviation ±1° Placement head heating temp Max.200℃ Placement head rotation angle Max.345° PCB loading method Manual Core motion module Linear motor+grating scale Customizable Yes Product Overview Automatic Compact Structure Sintering Die Bonder SDB200 with wafer loading
| Attribute | Value |
|---|---|
| Model | SDB 200 |
| Machine dimension | 1050(L)*1065(W)*1510(H)mm |
| Equipment net weight | Approx.900kg |
| Placement accuracy | ±10um |
| Placement angle deviation | ±1° |
| Placement head heating temp | Max.200℃ |
| Placement head rotation angle | Max.345° |
| PCB loading method | Manual |
| Core motion module | Linear motor+grating scale |
| Customizable | Yes |
Automatic Compact Structure Sintering Die Bonder SDB200 with wafer loading capability, designed for power semiconductor IC bonding market. Features a powerful BONDHEAD system with high precision bonding, pressure holding circuit maintaining and heating functions for presintering bonding of electric components.
- High speed and high accuracy die bonding
- Heating function for placement head and platform
- High accuracy temperature control system
- Precise force control system
- Wafer loading support
- Automatic nozzle change
- Automatic pin base change
- Compact structure with small footprint
Placement accuracy: ±10um
Rotation accuracy:±0.15°
Compact structure with self-developed gravity balance system for stable operation
8 inches wafer standard support
Automatic nozzle change with 5 nozzles
Presintering die bonder suitable for IGBT, SiC, DTS, resistance and other high temperature presintering processes. Mainly used in power module, power supply module, new energy, smart grid and other industrial applications.
| Parameter | Specification |
|---|---|
| Placement accuracy(um) | ±10 |
| Rotation accuracy(@3sigma) | ±0.15° |
| Placement angle deviation | ±1° |
| Placement Z axis force control(g) | 50-10000 |
| Force control accuracy(g) | 50-250g, repeatability ±10g; 250g-8000g, repeatability ±10% |
| Placement head heating temp | Max. 200℃ |
| Placement head rotation angle | Max. 345° |
| Placement heat cooling | air/nitrogen cooling |
| Chip size(mm) | 0.2*0.2～20*20 |
| Wafer size(inch) | 8 |
| Placement workbench heating temp | Max. 200℃ |
| Placement workbench heating zone temp deviation | ＜5℃ |
| Placement workbench available size(mm) | 380×110 |
| Max. Placement head XYZ axis stroke(mm) | 300x510x70 |
| Equipment repaceable nozzle number | 5 |
| Equipment replacement Pin module number | 5 |
| PCB loading method | Manual |
| Wafer loading Method | Semi-auto(manually place wafer cassette, automatically take wafer) |
| Core motion module | Linear motor+grating scale |
| Machine platform base | Marble platform |
| Machine main body dimension(L×W×H, mm) | 1050X 1065 X 1510 |
| Equipment net weight | Approx.900kg |
Inlet pipe specification: Ø10mm
Tracheal joint: 2 pieces
①Voltage: AC220V, frequency 50/60HZ
②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA
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