Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine
Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine Product Overview The CBD2200 IC Bonder is a high-precision machine designed for small batch placement operations. It features automatic bonding head switching capability for handling chips with varying parameters. Key Specifications Model CBD2200 Machine Dimensions 1610(L)×1380(W)×1620(H)mm Placement Accuracy ±10um@3σ Die Size Range 0.25×0.25mm to 10×10mm Substrate Size L300×W100 Placement Pressure 30-500g
The CBD2200 IC Bonder is a high-precision machine designed for small batch placement operations. It features automatic bonding head switching capability for handling chips with varying parameters.
- Supermini chip placement capability
- Ultrathin die bonding technology
- Automatic nozzle change system
- Bottom photo-taking for high precision placement
- Quick changeover between operations
| Parameter | Specification |
|---|---|
| Placement Accuracy | ±10um@3σ |
| Placement Angle Accuracy | ±0.3°@3σ |
| Loading Mode | Wafer box |
| Placement Head | 0-360° rotation/Auto change nozzle (option) |
| Core Motion Module | Linear motor + grating scale |
| Platform Base | Marble platform |
Ideal for small batch production of military RF products, power modules, and power amplifiers. Capable of automatically switching between various mounting heads to accommodate different chip parameters.
- Leakage protection switch: ≥100ma
- Compressed air: 0.4-0.6Mpa (Inlet pipe: Ø10mm)
- Vacuum requirement:
- Power: AC220V, 50/60HZ (Three core power copper wire ≥2.5mm²)
- Ground requirement: Must withstand 800kg/m² pressure
Recommended Products
Video
Video
Video
Video
Video