China Wire Bond Surface Coining Base Transistor Outline Package for sale

Wire Bond Surface Coining Base Transistor Outline Package

Name: Wire Bond Surface Coining Base Transistor Outline Package
Brand: JOPTEC LASER CO., LTD

Product Name Robust Coining Base with A Large Diameter Wire Bond Surface Product Model JOPTEC Plating Coating Fully plating Au or selective plating Au Finish Shell and pins are plated Ni:2~11.43um and Au≥1.3um;Cap is plated Ni:2~11.43um Product Formation Material Quantity 1. Base 4J29 1 2. Glass insulator BH-A/K 8 3. Pin 4J29 8 4. Cap 4J42 1 Insulation Resistance 500V DC resistance between all the pins linked and base is ≥1*10^9Ω Hermeticity Leak rate is ≤1*10^-3Pa.cm3/s

Brand Name JOPTEC

Payment Terms T/T

Place of Origin HEFEI, CHINA

Shell adopt material FeNiCo,FeNi42 or CRS;

Delivery Time 30 Days

Minimum Order Quantity 50 PCS

ss 316 wire mesh mini wire rope hoist 2 core wire 1mm

Product Description

Product Name	Robust Coining Base with A Large Diameter Wire Bond Surface
Product Model	JOPTEC
Plating Coating	Fully plating Au or selective plating Au
Finish	Shell and pins are plated Ni:2~11.43um and Au≥1.3um;Cap is plated Ni:2~11.43um
Product Formation	Material	Quantity
1. Base	4J29	1
2. Glass insulator	BH-A/K	8
3. Pin	4J29	8
4. Cap	4J42	1
Insulation Resistance	500V DC resistance between all the pins linked and base is ≥1*10^⁹Ω
Hermeticity	Leak rate is ≤1*10^^-3Pa.cm³/s
Product Features	1. Shell adopt material: FeNiCo,FeNi42 or CRS;
	2. The shape of pin is cyclinder and straight,material adopts Kovar.The shape of pin used as bonding is cyclinder or nailhead.
	3. The sealing cap method is percussion welding or tin welding.
	4. The rank of pin which cross the bottom of base could be choosen by customers.
	5. The position of ground pin can be choosen by customer.
	6. The design of caps need to fit the shell.
	7. Customer could choose shell fully plating or pin selective plating.