China TO8 Header Encapsulated Components Transistor Outline Package for sale

TO8 Header Encapsulated Components Transistor Outline Package

Name: TO8 Header Encapsulated Components Transistor Outline Package
Brand: JOPTEC LASER CO., LTD

Product name: Sealed enclosure alloy package for circuit Finish: Fully plating Au or selective plating Au. Plating coating: Plate and lead plating Ni:4-11.43um,plating Au:1.0-1.3um. Cap plating Ni:4-11.43um. Product formation: Material Quantity 1. Cap 10#Steel 1 2. Welding ring HLAgCu28 1 3. Lead 1 4J29(Kovar) 1 4. Glass insulator BH-G/K 3 5. Lead 2 4J29(Kovar) 3 6. Bottom floor 4J29(Kovar) 1 Insulation resistance 500V DC resistance between single glass sealed pin and shell

Welding ring HLAgCu28

Place of Origin HEFEI, CHINA

Bottom floor 4J29(Kovar)

Packaging Details Boxes

Supply Ability 5000000 PCS/Month

Hermeticity ≤1*10-3Pa.cm3/s

silicon npn power transistor trip to thailand package website header design

Product Description

Product name:	Sealed enclosure alloy package for circuit
Finish:	Fully plating Au or selective plating Au.
Plating coating:	Plate and lead plating Ni:4-11.43um,plating Au:1.0-1.3um. Cap plating Ni:4-11.43um.
Product formation:	Material	Quantity
1. Cap	10#Steel	1
2. Welding ring	HLAgCu28	1
3. Lead 1	4J29(Kovar)	1
4. Glass insulator	BH-G/K	3
5. Lead 2	4J29(Kovar)	3
6. Bottom floor	4J29(Kovar)	1
Insulation resistance	500V DC resistance between single glass sealed pin and shell is ≥1*10¹⁰Ω
Hermeticity	Leak rate is ≤1*10^-3Pa.cm³/s
Product features:	1. Shell adopt material:FeNiCo,FeNi42 or CRS;
	2. The shape of pin is cyclinder and straight,material adopts Kovar.
	3. The sealing cap method is percussion welding or tin welding.
	4. The rank of pin which cross the bottom of base could be choosen by customers.
	5. The position of ground pin can be choosen by customer.
	6. The design of caps need to fit the shell.
	7. Customer could choose shell fully plating or pin selective plating.