Magnetron Sputtering Machine
Main technical indexes: 1. ultimate vacuum: ≤6.6X10³Pa 2. vacuum acquisition system adopts molecular pump + mechanical pump unit 3. continuous pumping for 30 minutes, the vacuum degree is less than or equal to 8x10³Pa 4. cylindrical sputtering targets can work independently or at the same time The 5. substrate ≤60mm in diameter, can be heated to ≤700℃, with water cooling, substrate speed adjustable, adjustable target base moment Component Composition and specifications Vacuum
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