Encapsulating Fast Cure Resin

Smooth Casting Encapsulating Resin Epoxy with Plain and Glazing surface and High Hardness High Hardness Smooth Casting Encapsulating Resin Epoxy with Plain and Glazing surface 1. Low Viscosity, Smooth Casting 2. Faster curing, filling port surface bright and clean. 3. Flammability Property and Electric Property are good Description: WEXP-85 is a double-component black curable thermal-conductive & flame-retardant, filled epoxy electronically potting system with low adhesive