Encapsulating Low Viscosity Resin

Encapsulating Resin Epoxy electronic potting system double-component filled epoxy Main Features: Flammability Property and Electric Property are good Low Viscosity, Smooth Casting Faster curing, filling port surface bright and clean. Description: Encapsulating Resin Epoxy electronic potting system Electric and Physical Features of Insulation WEXP-85 is a double-component black curable thermal-conductive & flame-retardant, filled epoxy electronically potting system with low