DTS641A Double-Sided Heat Release Tape for MLCC Semiconductor Wafer Dicing Backgrinding | High-Adhesion No-Residue Thermal Debonding PET 90-150C | PCB Ceramic Glass LED Cutting Temp Fix Assembly | KHJ
Shenzhen KHJ Technology Co., Ltd
Price: Negotiable · MOQ: Negotiable · Delivery Time: Negotiable ·