Phase Changing Materials
Light Amber 1.8W Phase Change Thermal Conductive Pad 2.0g/cc Density 50-60℃ Softening Temperature
High-performance thermal interface pad with 5.0 W/mK thermal conductivity and phase change technology. Features natural tackiness, RoHS compliance, and minimal pump-out for reliable thermal management in automotive batteries, power supplies, and electronics. Available in multiple thicknesses from 0.003" to 0.010" with custom die-cut options.
TIC™800P Series Thermal Phase Change Material - 0.95 W/mK Conductivity, 0.003-0.010" Thickness Options
Advanced thermal phase change materials with 0.95 W/mK conductivity and 0.024℃-in²/W thermal resistance. Designed for high-performance computing applications including microprocessors, servers, and memory modules. Features natural tackiness, no adhesive requirement, and stable performance across -25°C to 125°C temperature range.
TIC™803Y Thermal Phase Change Material 0.95 W/mK with 0.024℃-in²/W Thermal Impedance
Advanced low melting point thermal interface material with 0.95 W/mK conductivity and 0.024℃-in²/W thermal impedance. Phase changes at 50°C to fill surface irregularities, reducing thermal resistance. Ideal for microprocessors, servers, and telecommunications equipment with exceptional thermal stability and minimal pump out.
TIC™803A Series Phase Change Thermal Interface Material 2.5 W/mK for IGBTs and Cache Chips
High-performance thermal interface material with 2.5 W/mK conductivity and 0.018℃-in²/W thermal resistance. Phase change technology eliminates heat sink preheating requirements. Ideal for microprocessors, servers, memory modules, and IGBT applications with excellent thermal stability.
TIC800K Series Phase Change Thermal Pad 1.6W/mK 0.102mm to 0.203mm Kapton Reinforced
High-performance phase change thermal pad with 1.6 W/mK conductivity and 4000-6000 VAC dielectric strength. Features Kapton reinforcement, low thermal resistance, and compatibility with microprocessors, servers, and telecommunications equipment. Available in standard thicknesses from 0.102mm to 0.203mm with custom die-cut options.
Gray Silver Phase Changing Material PCM Thermal Interface 0.126mm to 0.508mm Thickness
Low melting point PCM softens at 50°C to fill microscopic gaps, reducing thermal resistance. Features 2.5 W/mK conductivity, 0.014°C-in²/W resistance, and durability after 1000 hours at 130°C. Custom thicknesses and sizes available.
Excellent Thermal Conductivity Phase Change Thermal Paste For Automotive Electronics And New Energy Electronic Control System
Excellent Thermal Conductivity Phase Change Thermal Paste For Automotive Electronics And New Energy Electronic Control System Product Overview TIC® 800R-SP is a paste-like thermal phase change material that undergoes phase transition at operating temperature, fully filling the micro voids at the contact interface to significantly improve thermal conductivity efficiency. The material features a sturdy polymer phase change structure with excellent wetting properties within
Pink Phase Change Material CPU Cooling Tear Resistant 0.010in Thickness 0.95W/mK
TIC 810P series phase change material offers high thermal conductivity and dielectric strength. Softens at 50°C to fill gaps, reducing thermal resistance. Tear resistant, no performance loss after 1000h at 130°C. Ideal for CPUs, IGBTs, and LEDs. UL94 V-0 compliant.
Phase Change Thermal Pad 0.95W/mK Low Thermal Resistance 0.126mm to 0.254mm
TIC 805P series phase change material softens at 50°C to fill gaps, reducing thermal resistance. Features high thermal conductivity, dielectric strength, and durability. Ideal for CPUs, IGBTs, LEDs. RoHS compliant. Custom sizes available.
Custom Phase Change Thermal Conductive Silicone Insulation Pad 0.95W/mK 0.126mm
TIC800P series phase change material softens at 50°C to fill surface gaps, reducing thermal resistance. Features high thermal conductivity, dielectric strength, and tear resistance. Ideal for CPUs, IGBTs, LEDs. RoHS and REACH compliant. Custom sizes available.
1.6W/mK Phase Change Thermal Pad Sheet 0.127mm for Electronic Components
TIC800K series phase change material offers low thermal resistance and high dielectric strength. Softens at 50°C to fill surface gaps, reducing thermal impedance. Ideal for CPUs, IGBTs, and LEDs. Custom die-cut shapes available. RoHS and REACH compliant.
Thermal Conductive Phase Change Material 9.6W/mK 0.20mm for Chip Set Heat Dissipation
TIC 800T series phase change material offers ultra-high 9.6W/mK thermal conductivity. Softens above 50°C to fill gaps, reducing thermal resistance. Ideal for CPUs, GPUs, and power equipment. UL94 V-0 compliant. Custom sizes available.
7.5W/mK Thermal Conductive Phase Change Material 0.20mm for Server CPU Heat Dissipation
Ultra-high thermal conductivity phase change material with 7.5W/mK. Softens above 50°C to fill gaps, reducing thermal resistance. Ideal for server CPUs, GPUs, and power equipment. UL94 V-0 compliant. Custom thickness and shapes available.
5.0W Phase Change Silicone Pad Sheet 0.127mm Thermal Conductive Material for Laptop CPU
High-performance 5.0W/mK phase change silicone pad with 0.127mm thickness. Supports repeated assembly, excellent surface wetting, and low contact resistance. Ideal for optical modules, servers, and network equipment. UL V-0 rated, custom sizes available.
1.6W/mK Thermal Conductive PCM Phase Change Material for Telecommunication Hardware 0.102mm
TIC™800P-K1 series is a high thermal conductivity phase change material with Kapton reinforcement. It softens at 50°C to fill surface irregularities, reducing thermal resistance. Features 1.6W/mK conductivity, >3000VAC dielectric strength, and tear resistance. Ideal for telecom, automotive, and LED applications. Custom sizes available.
Phase Change Material PCM Thermal Interface Pad 2.5 W/mK for Server Heat Dissipation
TIC 812G series low melting point thermal interface material softens at 50°C to fill gaps, reducing thermal resistance. Features 0.014°C-in²/W resistance, natural tack, and no performance loss after 1000 hours at 130°C. Ideal for CPUs, servers, and IGBTs.
Pink Thermal Phase Change Interface Pad 0.95 W/mK for Computer Servers 0.076mm
Low melting point thermal pad softens at 50°C to fill gaps, reducing thermal resistance. Features 0.024°C-in²/W impedance, natural tack, no adhesive needed. Reliable after 1000h at 130°C. Ideal for CPUs, IGBTs, and memory modules.
RoHS Low Melting 1.5W Phase Change Thermal Pad 0.125mm for Laptop Computer
TIC 800K-A1 series phase change material offers low thermal resistance and self-adhesive application. Softens at 50-60°C to fill surface gaps, enhancing heat dissipation. Ideal for laptops, power supplies, and LED lighting. RoHS compliant, customizable shapes and thicknesses available.
TIC 800H-SP Thermal Phase Change Material 7.5 W/mK for Power Supply and Vehicle Battery
TIC 800H-SP is a high-performance thermal phase change paste with 7.5 W/mK conductivity and ultra-low thermal impedance. Designed for automotive, power, and telecom applications, it offers superior reliability, excellent wetting, and easy reworkability. Custom packaging available.
Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material 5.0 W/mK 0.127mm
TIC®800G Series phase change material softens at 50°C to fill gaps, reducing thermal resistance. Self-adhesive, low-pressure application. Ideal for laptops, power supplies, and LED lighting. Custom sizes available. Thermal conductivity 5.0 W/mK.