Copper Clad PCB
Immersion Tin Copper Clad PCB With Blind And Buried Vias , Prototype Circuit Boards
Immersion Tin Copper Clad PCB With Blind And Buried Vias , Prototype Circuit Boards PRODUCT’S DETAILS Raw Material FR-4 (Tg 180 available) Layer Count 10-Layer Board Thickness 2.0mm Copper Thickness 2.0oz Surface Finish ENIG(Electroless Nickel Immersion Gold) Solder Mask Green Silkscreen White Min. Trace Width/Spacing 0.075/0.075mm Min. Hole Size 0.25mm Hole Wall Copper Thickness ≥20μm Measurement 300×400mm Packaging Inner: Vacuum-packed in soft plastic bales Outer: Cardboard
OEM Communication Copper Clad PCB With High Tg / FR-5 / ROGERS RoHs
OEM Communication Copper Clad PCB With High Tg / FR-5 / ROGERS RoHs Description: Best service with quick response is always provided for our customers. Certifications of ISO9001:2008,UL,CE,ROHS,REACH,HALOGEN-FREE is meet. Advanced production equipment imported from Japan and Germany,such as PCB Lamination Machine, CNC drilling machine,Auto-PTH line, AOI(Automatic Optic Inspection),Probe Flying Machine and so on. Quality guarantee and professional after-sale service. All kinds