Cold Plate
DDR5 Compatible DIMM Server Cold Plate Electronics Cooling Radiator Module
DDR5 Compatible DIMM Server Cold Plate Electronics Cooling Radiator Module High-Density DIMM Liquid Cooling Radiator for Servers Advanced cooling solution compatible with DDR5 and MRDIMM memory modules, designed for high-performance server applications. Technical Specifications Structural Design: Modular cold plate with independent memory cooling fins (copper microchannels, fin density ≥ 8 fins/cm); supports narrow-pitch memory layouts (0.297-0.35 inches) and covers 8-16
Copper Brazed Liquid Tubed Cold Plate Connector UQD Quick Connect Fitting Module
Copper Brazed Liquid Tubed Cold Plate Connector UQD Quick Connect Fitting Module Product Overview Copper-Brazed Liquid Cold Plate Connector designed for UQD Quick-Connect Fitting Liquid Cooling Modules, ensuring reliable performance in demanding thermal management applications. Technical Specifications Connector Features: Drip-free design with residual hanging liquid volume below OCP standards; supports automatic blind mating with 0.8mm error compensation Fluid Compatibility:
NVIDIA GB200 Server Copper Brazed Cold Plate Liquid Cooler Thermal Solution
NVIDIA GB200 Server Copper Brazed Cold Plate Liquid Cooler Thermal Solution Product Overview NVIDIA GB200/GB300 Server Copper Brazed Cold Plate Liquid Cooler Technical Specifications Core Structure: Single-chip independent cold plate (compatible with B300 GPU) + 3D-printed titanium alloy microchannels (channel width < 0.3mm) Thermal Interface: Gallium-based liquid metal (thermal conductivity: 73 W/m*K), with thermal resistance as low as 0.02 cm²*K/W Cooling Capacity: Single
Noctua Low Power CPU Cooling Plate Air Cooled Thermal Management Solution
Noctua Low Power CPU Cooling Plate Air Cooled Thermal Management Solution Product Overview Noctua NH-U120P Low-Power Air-Cooled CPU Cooler delivers efficient thermal management through advanced engineering and precision manufacturing. Technical Specifications Structure Dual-tower fins with 6 pieces of 6mm U-shaped copper heat pipes, compatible with dual 120mm fans Fan Specifications 1400 RPM rotational speed, 66.17 CFM air flow, 25.6 dB(A) noise level Dimensions/Weight 125
Multi Channel Optical Module Cold Plates For Electronics Air Cooled Radiator Design
Multi Channel Optical Module Cold Plates For Electronics Air Cooled Radiator Design Product Overview Multi-channel Optical Module Air-cooled Radiator - High-performance cooling solution designed for high-density and high-speed optical modules in demanding data center and telecommunications applications. Technical Specifications Parameter Specification Material Copper base + heat dissipation fins (thermal conductivity ≥ 380 W/m*K) Compatible Optical Module Types OSFP/QSFP-DD
Compact Optical Module Cold Plates For Electronics Air Cooled Heat Sink Solution
Compact Optical Module Cold Plates For Electronics Air Cooled Heat Sink Solution Product Overview Compact Optical Module Air-cooled Heat Sink designed for Small Form-factor Pluggable (SFP) optical modules. This compact air-cooled heat sink provides efficient thermal management for high-performance optical communication systems. Technical Specifications Material Aluminum alloy / Copper alloy (thermal conductivity ≥ 180W/m·K) Compatible Optical Module Types QSFP/QSFP28 (for
Aluminum Pin Fin CPU Cold Plate Skived Heat Sink Cooling Solution
Aluminum Pin Fin CPU Cold Plate Skived Heat Sink Cooling Solution High-performance aluminum pin fin CPU cold plate with skived-fin technology for superior thermal management in demanding applications. Product SpecificationsMaterialAluminum alloy: AL1070, AL1060, AL1050 or customizedCopper alloy: Cu1100 or customizedProduction ProcessingDFM report → Design confirmation → Tooling design → Tooling making → Tooling testing → Cold forging → Fins cutting → Degreasing → CNC
High Power LTS Heat Pipe Cooling Plate Radiator Thermal Solution
High Power LTS Heat Pipe Cooling Plate Radiator Thermal Solution High-power LTS (Low-Temperature Sintering) Heat Pipe Radiator Advanced heat dissipation solution utilizing low-temperature sintering technology for superior thermal management in demanding applications. Technical Specifications Parameter Specification Structure Multi-heat pipe + aluminum fins (graphene-enhanced options available), supporting hybrid heat pipe + air cooling solutions Heat Dissipation Capacity
Staggered Fin High Temperature Cold Plate Copper Liquid Cooling Radiator Design
Staggered Fin High Temperature Cold Plate Copper Liquid Cooling Radiator Design High-temperature Copper Staggered Fin Radiator For Liquid Cooling Plate Heat dissipation plays a pivotal role in the development of the digital economy. As the physical cornerstone of digital infrastructure and an indispensable key link in the computing power industry chain, thermal management technology strongly underpins various digital scenarios—from national-level data centers, artificial
Inverter Compatible Liquid Cooled Cold Plate Heat Dissipation Thermal Solution
Inverter Compatible Liquid Cooled Cold Plate Heat Dissipation Thermal Solution Product Overview This liquid cooling component is specially designed for photovoltaic inverters, energy storage inverters, wind power converters and industrial frequency converters. It circulates coolant through internal flow channels to dissipate heat generated by core components such as IGBTs, SiC power modules, inductors and busbars, ensuring stable full-load operation of equipment. It is mainly
220 Series 600W Copper Tube Cold Plate Heat Sink Skived Fin Design
220 Series 600W Copper Tube Cold Plate Heat Sink Skived Fin Design Product Overview 220-Series Skived Heat Sink - 600W Copper Tube Skived Fin Heat Sink designed for advanced thermal management solutions in demanding applications. Specification Details Item Type Custom heat sink Material Aluminum, Copper Size Standard or customized size Colors Silver, black, blue, wood color, RAL powder coating color, and more Shape Round, Square, Flat, or customized Thickness 0.4mm-20mm or