Bare Die Trays
Bare Die Tray 101.6x101.6x4.50mm Antistatic Semiconductor IC Carrier
Permanently antistatic, dustproof, and wear-resistant bare die tray with flatness
2x2 Inch Anti Static Waffle Tray for Semiconductor Bare Dies 12 Pocket ESD Protection
Precision-molded conductive ABS tray for secure storage and handling of semiconductor bare dies and CSPs. Features a compact 2x2 inch footprint with 12 customizable pockets. Provides ESD protection, dimensional stability, and compatibility with automated processes. Ideal for inspection, sorting, and packaging.
Customizable 2x2 Inch Conductive Waffle Tray for Microchip Storage 162 Pocket ESD Protection
This precision-molded 2x2 inch waffle tray offers 162 pockets for safe microchip storage. Made of conductive ABS polymer, it provides reliable ESD protection and resists warping. Customizable pocket shapes and heat-resistant versions available for thermal testing. Ideal for bare die and CSP handling.
Stackable Cleanroom-Safe Conductive Waffle Tray 2x2 Inch 88 Pocket for Chip Storage
Precision-molded conductive ABS tray for safe storage and transport of semiconductor die and CSP. 2x2 inch footprint with 88 pockets, 0.2mm warpage tolerance, and ESD protection. Customizable pocket shapes, stackable design, and heat-resistant options available for automated workflows.
ESD Proof Heat Resistant Chip Tray 2 Inch 4 Inch for IC Module Packaging
Crafted from ESD-safe carbon fiber reinforced polymers, these waffle pack trays withstand 180°C bake temperatures. Available in 2-inch and 4-inch sizes with customizable pocket geometry. Durable, reusable, and ideal for secure chip module handling.
PC Small Cavity Tray for Semiconductor Bare Dies 2-Inch 4-Inch Optional Lid Clip
ESD-safe PC waffle pack tray for transport of bare dies and microelectronic components. Durable, reusable, and heat-resistant up to 180°C. Available in 2-inch and 4-inch sizes with customizable pocket geometry. Optional lid and clip included.
ESD Bare Die Chip Tray 2 Inch 4 Inch Waffle Pack for Dust-Free Die Storage 50 Pockets
Molded from ESD-safe carbon-fiber reinforced polymers, these chip trays offer durable, reusable storage for dies and optoelectronic components. With high temperature resistance up to 180°C and customizable pocket sizes, they ensure safety and efficiency in cleanroom environments.
ESD Safe Waffle Pack Chip Tray 2 Inch 4 Inch for IC Handling Packaging Inspection Ultrasonic Cleaning
Molded from ESD-safe, carbon-powder-free polymers with carbon-fiber reinforcement for strength and permanent protection. Supports up to 180°C bake temperature. Industry-standard 2" and 4" sizes with customizable pocket geometry. Durable, reusable, and eco-friendly.
ESD Safe ABS Bare Die Tray 2 Inch 4 Inch Waffle Pack with Lid and Clip
Molded from ESD-safe, carbon-fiber-reinforced polymers, this ABS bare die tray offers durable, reusable protection for chips and dies. Withstands up to 180°C bake temperature. Available in 2-inch and 4-inch industry-standard formats, with customizable pocket sizes and optional lid/clip accessories.
Chip Scale Packages IC Die Carriers 2 Inch 4 Inch Waffle Pack Trays 690PCS
ESD-safe ABS die carriers for precise placement and stackable storage. Temperature range friendly, 100% clean room certified. Customizable pocket sizes and bakeable materials. Durable, reusable, and biodegradable for semiconductor transport and testing.
Precision Machining Bare Die Trays 160 Pockets ABS ESD Safe Transport Injection Moulding
Durable ABS bare die trays with 160 pockets for safe transport and handling. ESD safe, clean room certified, and temperature resistant. Customizable sizes and pocket geometry available. Ideal for semiconductor die assembly and testing.
ESD Protection 2 Inch Chip Tray 80 Cells ABS Waffle Pack for Microelectronics
Durable 2-inch waffle pack chip tray with ESD protection for safe handling and transport of bare die and CSP. Features 80 cells, ABS material, clean room certified, reusable, and customizable size and pocket geometry.
Compact Grid Bare Die Tray 256 Pockets 1.65mm for Semiconductor Storage
ESD-safe waffle tray with 256 pockets for bare die storage and transport. Clean room certified, temperature resistant, and reusable. Customizable pocket size and dimensions available for semiconductor facilities.
2 Inch Injection Mold Bare Die Tray High Temperature Resistance 84 Pockets Clean Room ESD Safe
Durable 2-inch waffle pack tray for bare die and CSP handling. Features 84 pockets, ESD protection, and high temperature resistance. Certified for clean room use. Custom sizes and pocket geometry available. Ideal for semiconductor transport and testing.
ESD Protection Bare Die Tray 270 Pockets 3.92x3.02mm for Small Chip Components
Custom bare die tray with 270 pockets, each 3.92x3.02mm, made from durable ABS conductive plastic. Protects small dies and CSPs from ESD damage. Stackable, reusable, and customizable in size, color, and features. Ideal for safe transport and storage.
4 Inch Black Customizable Chip Tray with Stackable Die Holders 105 Pockets
Compact 4-inch bare die tray with 105 stackable chip holders, ideal for small dies and CSPs. Made from durable conductive ABS plastic to prevent ESD damage. Customizable pocket size and color. Reusable, eco-friendly, and compatible with JEDEC tray feeders.
Anti-Static Bare Die Tray 143 Pockets for Chip Scale Packages CSP 5.95x4.7mm
Durable anti-static bare die trays with 143 pockets, designed for Chip Scale Packages and small dies. Made from conductive PC material, they prevent ESD damage and ensure secure component protection. Custom sizes and materials available for your specific requirements.
Anti-Static Bare Die Tray for Chip Scale Packages - 13.35×48.6×0.1mm Pocket Size, 7-Position Matrix, High Temperature Resistance
Compact anti-static bare die trays designed for chip scale packages and small die components. Features 13.35×48.6×0.1mm pocket dimensions, 7-position matrix layout, and high temperature resistance. Made from conductive plastics for ESD protection, these stackable trays are customizable for specific die sizes and compatible with automated handling systems.
Anti-Static ABS Injection Molding Bare Die Trays - 2/3/4 Inch Sizes with 416 Pocket Capacity for Microelectronic Components
Professional anti-static bare die trays manufactured with ESD-compliant ABS materials. Available in 2, 3, and 4-inch sizes with up to 416 pockets. Features dimensional stability, cleanroom compatibility, and custom design options. Ideal for chips, dies, COG devices, and optoelectronic components with 2-week custom manufacturing turnaround.
Stackable Waffle Pack Bare Die Tray 2-4 Inch Sizes for Microelectronic Chip Packaging with ESD Protection
Professional bare die trays for microelectronic components featuring permanent antistatic protection (ESD/RoHS compliant), dust-free packaging for cleanrooms class 10-1000, and custom design capabilities. Available in 2-inch, 3-inch, and 4-inch sizes with materials including Antistatic/Conductive ABS and PC. Ideal for semiconductor, medical, and precision component applications.