Electronic Components Tray
Customized ABS Chip Tray 25.7x6.4x0.41mm Pocket JEDEC Semiconductor Loading Tray 280x210x15mm
Precision-molded ABS chip tray with 80 pockets (25.7x6.4x0.41mm) for secure IC loading. Features anti-static surface resistance, low warpage ≤0.76mm, and flexible customization. CE, FCC, RoHS certified. Ideal for quantum, consumer, and industrial chip production.
Custom ESD IC Chip Tray 129.98x129.98mm Waffle Pack for Electronic Component Packaging
Durable PC anti-static IC chip tray with 25 pockets, 15.3x15.3mm each. Reusable design protects sensitive components during storage and transport. ISO 9001, SGS, ROHS certified. Custom sizes available.
4 Inch Black ABS Waffle Pack IC Chip Tray 550 Pockets Storage Protection
Durable 4 inch black ABS waffle pack IC chip tray with 550 pockets (22x25 matrix). Lightweight, anti-static, and edge chamfer design prevents stacking errors. Ideal for semiconductor manufacturing, testing, and supply chain management. Custom options available.
HN22003 ESD Packaging Tray 172.5x156x25mm with 200-PCS Matrix for Electronic Components
Injection molded ESD trays with 1.0x10⁴-1.0x10¹¹Ω resistance for electronic component protection. Features 20x30 matrix design, ROHS certification, and custom OEM/ODM services. Perfect for automated assembly lines with precise 0.5mm flatness tolerance and stackable design.
ABS Loading Filter Chip Tray 101.6×101.6×7.9mm with 0.3mm Flatness for Semiconductor Packaging
Precision ABS injection molded chip tray with 0.3mm flatness and 9×9 matrix design holding 81 components. Features anti-static properties, ROHS/SGS certification, and custom OEM/ODM services. Ideal for semiconductor, photoelectric, and electronic industries requiring high cleanliness and component protection.
PEI ESD Plastic Electronic Components Tray 220x160x13.7mm with 160 Cavities for IC Packaging
Professional ESD PC injection molded trays with surface resistance of 10⁴-10¹¹Ω, designed for electronic component protection during manufacturing and transportation. Features color-coded organization, ROHS compliance, and superior static dissipation to prevent component damage. Ideal for IC packaging, CSP, and microelectronic device handling with 160-cavity matrix configuration.