JEDEC IC Trays
JEDEC IC Trays for Dust Reduction and Durable Protection in Semiconductor Packaging
JEDEC IC Trays for Dust Reduction and Durable Protection in Semiconductor Packaging JEDEC IC Tray is engineered to minimize dust contamination, keeping semiconductor components clean throughout packaging processes. Sturdy structure ensures reliable protection against impacts and scratches during handling. JEDEC IC Tray meets strict JEDEC standards, guaranteeing compatibility with automated production lines. It maintains component integrity, reducing waste and supporting
Heat Resistant MPPO JEDEC IC Trays Safeguard Integrated Circuits From Contamination And Impact
Heat Resistant MPPO JEDEC IC Trays Safeguard Integrated Circuits From Contamination And Impact JEDEC IC Tray is crafted from heat-resistant MPPO material, designed to protect delicate integrated circuits from contamination and physical impact. Rigid structure keeps ICs stable and secure during automated handling and transport. JEDEC IC Tray adapts to diverse production needs with customizable cavity layouts and dimensions. Whether standard JEDEC specifications or tailored
JEDEC IC Trays 322.6x135.9x7.5mm MPPO Dust Protection for Semiconductor Assembly
Heat-resistant MPPO JEDEC trays shield ICs from dust and impact. Custom cavity layouts available. ISO and RoHS certified. Integrate with automated lines and cleanrooms for efficient production and safe transit.
Durable PC JEDEC IC Tray 322.6x135.9x9.5 mm Cavity 11.31x27.68 mm Reusable Semiconductor Protection
Durable PC JEDEC IC trays with 322.6x135.9x9.5 mm outline and 11.31x27.68 mm cavity. Reusable design protects semiconductors from dust and impact. ISO certified, RoHS compliant, customizable cavity shapes. Ideal for cleanroom and automated assembly.
Heat-Resistant MPPO JEDEC IC Tray 322.6x135.9mm Customizable Cavity for Semiconductor Packaging
Durable JEDEC IC tray made of heat-resistant MPPO, withstands up to 150°C. Reduces dust and prevents IC shifting. Fully customizable cavity sizes and grid layouts. Meets JEDEC standards. Ideal for automated packaging, cleanrooms, and high-temperature processes. OEM/ODM accepted.
Hiner-pack HN25016 JEDEC IC Tray 322.6x135.9mm PPE Black for Wafer Packaging
Durable JEDEC IC tray in black PPE material, sized 322.6x135.9mm. Offers effective dust prevention and rigid stability for clean wafer handling. Supports OEM/ODM customization of cavity dimensions. Ideal for semiconductor packaging, die sorting, and cleanroom workflows.
Durable JEDEC IC Tray 322.6x135.9mm for Wafer Handling Cleanroom 130°C
Durable JEDEC IC tray with PPE material, 1.0×10⁴-1.0×10¹¹ Ω resistance, and max warpage 0.76mm. Protects wafers in clean environments up to 130°C. Supports OEM/ODM custom cavity sizes and layouts for automated production lines.
Durable JEDEC IC Tray 322.6x135.9x7.62mm for Dust-Free Semiconductor Packaging
Shield delicate semiconductors from dust and damage. Meets JEDEC standards with durable MPPO construction. Features 36 cavities, anti-static resistance, and custom pocket options. Ideal for cleanroom automation, testing, and logistics. OEM/ODM available.
Durable JEDEC IC Tray 322.6x135.9mm for Wafer Dust Protection and Clean Production
Durable JEDEC IC tray with 1.0×10⁴-1.0×10¹¹ Ω resistance, 322.6x135.9mm outline. Effectively blocks dust, safeguards wafers. Custom cavity designs available. Ideal for automated assembly, cleanrooms, and semiconductor packaging.
High Capacity JEDEC IC Trays 322.6x135.9mm for Large Semiconductor Modules
High Capacity JEDEC IC Trays feature a deep cavity design and PPE anti-static material for secure placement of large semiconductor modules. Custom pocket options available. Provides stable support and effective transport damage prevention for ESD-sensitive devices.
PPE Anti-Static JEDEC IC Tray 322.6x135.9mm for Semiconductor Logistics Protection
Durable PPE anti-static JEDEC IC tray with ESD protection, heat resistance up to 180°C, and strong impact resistance. Ideal for automotive, industrial, and consumer semiconductor logistics. Custom cavity options and OEM/ODM available.
JEDEC IC Tray 322.6x135.9mm 264 Cavity for Wafer Level Packaging Cleanroom ESD Protection
Specialized JEDEC IC tray with ultra-low particle generation and stable ESD protection for cleanroom wafer level packaging. Custom cavity design available. Reliable chip protection for semiconductor manufacturing and transport.
Custom Stackable JEDEC IC Trays 322.6x135.9mm ESD Protection MPPO
Custom JEDEC IC trays with ESD protection for semiconductor factories. Made of conductive MPPO, resistance 1.0×10⁴–1.0×10¹¹ Ω. Stackable design saves space. High precision, low warpage. Accept OEM/ODM. Ideal for IC packaging, testing, and logistics.
High Precision JEDEC Tray for Fine Pitch IC 322.6x135.9mm 66 Cavities
Precision-machined JEDEC tray for fine pitch ICs ≤0.5 mm. ESD-safe with surface resistance 1E4-1E11 Ω. Compatible with automated handling systems. Fully customizable pockets for secure positioning and long lifecycle. Ideal for QFN, BGA, CSP packaging.
Reusable ESD JEDEC Tray 322.6x135.9mm for Semiconductor IC Storage and Transport
Durable ESD-safe JEDEC tray for IC logistics and storage. Reusable, stackable design reduces waste and costs. Compliant with JEDEC standards, ensures precise chip alignment for automated handling. Custom pocket options available. Ideal for semiconductor transport and warehousing.
Hiner-pack JEDEC Tray 322.6x135.9mm MPPO Anti-static for IC BGA CSP Protection
High-precision JEDEC tray with V-groove cavities, anti-static and ESD-safe MPPO material. Minimizes particle contamination and chip damage. Ideal for fine-pitch ICs, BGA, and CSP packages. Custom pocket options available. Supports OEM/ODM.
Custom JEDEC IC Tray 322.6x135.9x7.62mm MPPO Anti-static for Semiconductor Production
Custom JEDEC IC tray made of MPPO anti-static material for cleanroom use. Lightweight, stable structure with 108 cavities protects chips from contamination and damage. Supports OEM/ODM custom pocket options. Ideal for semiconductor fabs and ESD-sensitive device transport.
Precision JEDEC IC Tray 322.6x135.9x7.62mm for Advanced Semiconductor Packaging
Custom JEDEC IC tray with high-precision cavities for complex IC modules. Features excellent anti-static performance (1.0×10⁴-1.0×10¹¹ Ω), MPPO material, and 490 cavities per tray. Fully customizable per chip design. Ideal for SiP, MEMS, and fine pitch IC packaging.
High Temp JEDEC Tray 150°C ESD Protection 322.6x135.9mm for AI Chip BGA Packaging
High-temperature JEDEC tray with ESD protection (1E4-1E11 Ω) and heat resistance up to 150°C. Made from premium PEI material, it ensures low warpage and dimensional stability for automated handling. Compatible with ASM/Advantest/YAMAHA machines. Free custom design with 24-hour turnaround. Ideal for AI chips, BGA, and IC packaging.
Reusable JEDEC Tray 322.6x135.9x7.62mm with ESD Protection 180 Cavities
Engineered with electrostatic dissipative polymer, this JEDEC tray protects ICs from static and shock. Stackable, reusable, and automation-compatible. RoHS and ISO certified. Supports OEM/ODM customization for semiconductor handling and storage.