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TI's GaN technology and real-time MCUs power LITEON Technology's new server power supply design 2023-03-09

TI's GaN technology and real-time MCUs power LITEON Technology's new server power supply design

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First ultrasonic lens cleaning chipset enables self-cleaning cameras and sensors 2023-03-09

First ultrasonic lens cleaning chipset enables self-cleaning cameras and sensors

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Launch of First Portable, IP69K-Rated Super-Safeway Ground Fault Circuit Interrupter (GFCI) 2023-03-09

Launch of First Portable, IP69K-Rated Super-Safeway Ground Fault Circuit Interrupter (GFCI)

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Molex Introduces PCIe Cabling System for Open Compute Project Servers 2023-03-09

Molex Introduces PCIe Cabling System for Open Compute Project Servers

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PIC16F171xx/PIC16181xx Microcontrollers 2023-03-09

PIC16F171xx/PIC16181xx Microcontrollers

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STMicroelectronics reveals STM32WBA52 wireless microcontrollers with SESIP3 security, tailored for IoT devices 2023-03-09

STMicroelectronics reveals STM32WBA52 wireless microcontrollers with SESIP3 security, tailored for IoT devices

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NXP and VinFast will engage in the early development phases of new VinFast automotive projects, leveraging NXP’s rich portfolio of system solutions for innovative applications. 2023-01-14

NXP and VinFast will engage in the early development phases of new VinFast automotive projects, leveraging NXP’s rich portfolio of system solutions for innovative applications.

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STMicroelectronics eases and accelerates user-interface design on STM32 MCUs with new TouchGFX Stock 2023-01-14

STMicroelectronics eases and accelerates user-interface design on STM32 MCUs with new TouchGFX Stock

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STMicroelectronics enhances digital power combination controller for overload stability and regulation 2023-01-14

STMicroelectronics enhances digital power combination controller for overload stability and regulation

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STPOWER automotive-grade devices from STMicroelectronics run cooler in surface-mount ACEPACK SMIT package 2023-01-14

STPOWER automotive-grade devices from STMicroelectronics run cooler in surface-mount ACEPACK SMIT package

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STMicroelectronics and eYs3D Microelectronics to showcase collaboration on high-quality 3D stereo-vision camera for machine vision and robotics at CES 2023 2023-01-14

STMicroelectronics and eYs3D Microelectronics to showcase collaboration on high-quality 3D stereo-vision camera for machine vision and robotics at CES 2023

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STMicroelectronics brings 32-bit kick to cost-sensitive 8-bit applications with STM32C0 series microcontrollers 2023-01-14

STMicroelectronics brings 32-bit kick to cost-sensitive 8-bit applications with STM32C0 series microcontrollers

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Break through the US blockade! This type of chip begins mass production 2023-01-10

Break through the US blockade! This type of chip begins mass production

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