Image Module (1)
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Customized Image Modules ODM / OEM For Machine Vision Cameras
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Image Sensor Packaging (1)
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Customized Image Sensor Packaging Services For PLCC BGA Ceramic Packages
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
MEMS Sensor (1)
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Custom MEMS Sensors Packaging For Consumer Electronics / Industrial Inspection
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
SMT Testing (6)
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Automated Precision SMT Testing For Microelectronics Supporting Industries
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
SMT Surface Mounting Process For Solder Paste Printing / Component Placement / Reflow Soldering
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Customization SMT Reflow Soldering Process For Electronic Products
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
High Precision SMT Mounting Process Customized Electronics Manufacturing Service
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
SIP Packaging (6)
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3D SiP can customize differentiated 3D stacking architectures according to customer requirements
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
2.5D SiP can integrate various bare dies to meet differentiated functional requirements
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Stacked die SiP supports the integration of various types of dies such as memory and power dies
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
The overall technical architecture of the 2D ‑ plane SiP is concise and highly implementable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable